5SGSMD6N2F45C3N

The 5SGSMD6N2F45C3N is a Stratix V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1932-ball FCBGA package. It provides a high-density programmable logic fabric with a large embedded memory complement and a high I/O count for complex digital designs.

Engineered for commercial-temperature applications, this device targets designs that require up to 583,000 logic elements, approximately 46.08 Mbits of on-chip RAM, and up to 840 I/O pins while operating from a low-voltage core supply of 0.82–0.88 V.

Key Features

• Core Logic  Provides 583,000 logic elements to implement complex, high-density digital functions.
• Embedded Memory  Contains approximately 46.08 Mbits of on-chip RAM for large buffering and data storage close to logic.
• I/O Capacity  Up to 840 general-purpose I/O pins to support wide interfaces and dense board-level connectivity.
• Power and Voltage  Core supply range of 820 mV to 880 mV to match low-voltage system designs.
• Package & Mounting  Available in a 1932-ball BGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Temperature & Grade  Commercial temperature grade rated for 0 °C to 85 °C operation.
• Regulatory  RoHS-compliant manufacturing.

Typical Applications

• High-density digital systems  Use the device where large logic capacity and embedded memory are required to implement complex datapaths and control logic.
• High I/O connectivity  Suitable for systems that require extensive board-level interfacing or parallel data channels thanks to up to 840 I/O pins.
• Prototype and system development  Fits commercial designs and development platforms that need a full-featured Stratix V GS device in a 1932-ball FCBGA package.

Unique Advantages

• High integration density: 583,000 logic elements combined with approximately 46.08 Mbits of embedded RAM reduce external component needs and shorten design cycles.
• Extensive I/O resources: Up to 840 I/O pins enable complex interfacing and high-bandwidth board designs without additional I/O expanders.
• Low-voltage core operation: 820–880 mV supply window supports modern low-power digital system requirements.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, matching a wide range of standard commercial deployments.
• Surface-mount, high-pin-count package: 1932-ball FCBGA package provides dense interconnect in a board-friendly surface-mount form factor.
• RoHS compliant: Manufactured in accordance with RoHS requirements to meet regulatory directives.

Why Choose 5SGSMD6N2F45C3N?

The 5SGSMD6N2F45C3N positions itself as a high-capacity Stratix V GS FPGA option for commercial designs that demand substantial logic resources, on-chip memory, and a large number of I/O. Its combination of 583,000 logic elements, approximately 46.08 Mbits of embedded RAM, and up to 840 I/O make it suitable for complex digital implementations within the commercial temperature range.

Documentation for the Stratix V family is available to support integration and electrical characterization; the device’s package, supply range, and compliance attributes make it a pragmatic choice for teams standardizing on Stratix V GS devices in board-level designs.

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