5SGSMD6N2F45I2G

The 5SGSMD6N2F45I2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. This device provides a high logic capacity FPGA fabric with extensive on-chip memory and a large number of I/O for complex, board-level digital designs.

Key hardware details include 583,000 logic elements, approximately 46 Mbits of embedded memory, and 840 I/O pins in a 1932-BBGA (FCBGA) surface-mount package. The device is specified for industrial-grade operation and supports a core supply range of 870 mV to 930 mV with an operating temperature range of –40 °C to 100 °C.

Key Features

• Logic Capacity  Provides 583,000 logic elements to implement large and complex digital designs.
• LABs/CLBs  Includes 220,000 LABs/CLBs for structured logic partitioning and resource organization.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM suitable for buffering, state storage, and local data processing.
• I/O Density  840 I/O pins to support broad peripheral connectivity and multi-channel interfaces.
• Power  Core supply voltage range from 870 mV to 930 mV, enabling designers to plan power delivery and sequencing precisely.
• Package & Mounting  1932-BBGA (FCBGA) package in a 45 × 45 mm supplier device package; surface-mount mounting for compact board integration.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C.
• Compliance  RoHS compliant.
• Family Context  Part of the Stratix V family, which the datasheet describes for device electrical and switching characteristics and speed-grade options.

Typical Applications

• Networking & Telecommunications  Large logic capacity and many I/Os enable implementation of switching, packet processing, and protocol handling functions.
• Data Center & Acceleration  Substantial on-chip RAM and logic resources support custom acceleration engines and high-throughput datapaths.
• Industrial Systems  Industrial temperature grading and robust I/O count make the device suitable for control, automation, and instrumentation applications.
• High-Density FPGA Designs  Large LAB/CLB and logic element counts allow consolidation of multiple functions onto a single device to reduce system complexity.

Unique Advantages

• Large Logic Resource Pool: 583,000 logic elements enable complex state machines, datapaths, and custom compute blocks on a single device.
• Significant Embedded Memory: Approximately 46 Mbits of on-chip RAM reduces dependence on external memory for buffering and local processing.
• High I/O Count: 840 I/Os provide flexibility for multi-channel interfaces and extensive peripheral connectivity without additional bridging components.
• Industrial Temperature Range: Rated from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact Surface-Mount Package: 1932-BBGA (FCBGA) footprint supports high-density board designs while maintaining a standardized supplier device package.
• Standards Compliance: RoHS compliant to support regulatory and manufacturing requirements.

Why Choose 5SGSMD6N2F45I2G?

The 5SGSMD6N2F45I2G combines extensive logic capacity, substantial embedded memory, and a very high I/O count in a single industrial-grade Stratix V GS FPGA package. These attributes make it well suited for designs that require consolidation of complex functions, large on-chip data handling, and broad external interfacing while operating across an extended temperature range.

Selecting this device supports scalable, robust designs where on-chip resources and I/O density are key drivers. Its package and electrical characteristics allow system designers to plan power delivery, board layout, and thermal considerations with the supplied specification set and family-level electrical guidance from the Stratix V datasheet.

Request a quote or submit a product inquiry to obtain pricing, lead time, and availability for the 5SGSMD6N2F45I2G.