5SGSMD6N2F45I3LN

The 5SGSMD6N2F45I3LN is a Stratix V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It delivers high-density programmable logic, large embedded memory, and a broad I/O complement to support complex digital designs in industrial environments.

Key value comes from its sizable logic capacity, approximately 46 Mbits of on-chip RAM, and an 840-pin I/O count, enabling integration of large, performance-driven systems while operating across a wide industrial temperature range.

Key Features

• Core Logic 583,000 logic elements (cells) for high-density implementation of complex logic and compute functions.
• Embedded Memory Approximately 46 Mbits of on-chip RAM to support large buffering, state storage, and data processing tasks.
• I/O Capability 840 user I/Os to accommodate wide external connectivity and high-pin-count interfaces.
• Package & Mounting 1932-BBGA, FCBGA (supplier device package: 1932-FBGA, FC 45×45) in a surface-mount form factor for board-level integration.
• Power Core supply voltage range of 820 mV to 880 mV for the device core power domain.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for use in industrial-temperature applications.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital processing — Implement large logic fabrics and complex state machines using the device’s 583,000 logic elements.
• Embedded memory-intensive designs — Leverage approximately 46 Mbits of on-chip RAM for buffering, packet memory, and deep data-path storage.
• I/O-rich systems — Utilize up to 840 I/Os for multi-channel interfaces, wide parallel buses, or extensive sensor/actuator connections.

Unique Advantages

• High logic density: 583,000 logic elements enable consolidation of multiple functions into a single FPGA to reduce board-level complexity.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory minimizes the need for external RAM in many application architectures.
• Extensive I/O headroom: 840 I/Os provide flexibility for multi-protocol interfacing and high-channel-count designs.
• Industrial-grade operation: Rated for −40 °C to 100 °C, supporting deployment in industrial temperature environments.
• Compact, high-pin-count packaging: 1932-BBGA FCBGA (45×45) supports dense routing and robust board-level implementation in surface-mount form.
• Low-voltage core domain: Core supply range of 820–880 mV supports integration into modern low-voltage power architectures.

Why Choose 5SGSMD6N2F45I3LN?

The 5SGSMD6N2F45I3LN positions itself as a high-density Stratix V GS FPGA option for industrial designs that require large programmable logic capacity, significant on-chip memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding environments where robustness and regulatory adherence matter.

This device is suitable for engineers and system designers seeking to reduce BOM complexity by integrating large-functionality blocks into a single FPGA, while maintaining the thermal and power characteristics required by industrial applications.

Request a quote or submit an inquiry to evaluate how 5SGSMD6N2F45I3LN can fit into your next design and to obtain pricing and availability information.