5SGSMD6N3F45C2LG

The 5SGSMD6N3F45C2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 1932‑BBGA (FCBGA) package. It delivers large on‑chip memory and high I/O density for commercial electronic designs.

Targeted at commercial temperature applications, the device’s architecture supports designs that require substantial logic capacity, significant embedded memory, and a high number of I/O interfaces while operating within an 0 °C to 85 °C temperature range.

Key Features

• Core Logic  Approximately 583,000 logic elements to implement complex digital designs and large-scale logic functions.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, packet processing, and large state machines without external memory.
• I/O Density  Up to 840 I/O pins, enabling high‑pin‑count interface routing and connection to multiple peripherals or high‑channel systems.
• Power and Voltage  Core supply range specified from 820 mV to 880 mV, allowing precise power budgeting at the device core.
• Package and Mounting  1932‑BBGA, FCBGA package (supplier device package: 1932‑FBGA, FC, 45×45) in a surface‑mount form factor for high‑density PCB integration.
• Temperature Grade  Commercial grade rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• High‑density logic systems  For designs that require approximately 583,000 logic elements to implement large digital functions and custom accelerators.
• Memory‑intensive designs  Where approximately 46.08 Mbits of embedded RAM supports buffering, local data storage, and fast on‑chip access patterns.
• High‑I/O interface platforms  Systems needing up to 840 I/O signals for extensive peripheral connectivity and multi‑channel interfacing.
• Commercial electronic products  Deployments operating within the commercial temperature range (0 °C to 85 °C) and requiring surface‑mount assembly.

Unique Advantages

• Large logic capacity: Approximately 583,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial on‑chip RAM: Approximately 46.08 Mbits of embedded memory minimizes reliance on external DRAM for many buffering and processing tasks.
• High I/O count: Up to 840 I/Os simplify board design for complex multi‑interface systems and dense signal routing.
• Compact, high‑density package: 1932‑BBGA (45×45) FCBGA delivers a high pin‑count solution in a surface‑mount package suitable for space‑constrained PCBs.
• Commercial operating range: Rated for 0 °C to 85 °C to meet standard commercial product requirements.
• Regulatory readiness: RoHS compliance supports environmentally conscious design and manufacturing processes.

Why Choose 5SGSMD6N3F45C2LG?

The 5SGSMD6N3F45C2LG combines large logic capacity, significant embedded memory, and very high I/O density in a compact 1932‑BBGA surface‑mount package, making it well suited for commercial systems that consolidate complex digital functions. Its specified core voltage range and commercial temperature rating enable controlled power and thermal planning for production designs.

Engineers choosing this Stratix V GS device benefit from a documented device family and datasheet references that describe electrical and switching characteristics, helping with integration and validation in commercial deployments.

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