5SGSMD6N3F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,940 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6N3F45C2LN – Stratix® V GS FPGA, 583,000 logic elements, 840 I/Os

The 5SGSMD6N3F45C2LN is a Stratix® V GS field programmable gate array (FPGA) in a 1932‑BBGA FCBGA package designed for commercial temperature applications. It combines high logic density, substantial embedded memory, and a large I/O count to address complex digital integration tasks where large-scale programmable logic and extensive external interfacing are required.

The device and its family documentation include electrical and switching characteristic details such as operating conditions, power consumption, transceiver specifications, and I/O timing, enabling engineers to evaluate system integration and performance within defined commercial operating limits.

Key Features

  • Core Logic  Approximately 583,000 logic elements (cells) provide large programmable logic resources for complex designs and high-density integration.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and local storage for data-path and control logic.
  • I/O Capacity  840 user I/Os support broad external connectivity and multiple parallel interfaces in a single device.
  • Package & Mounting  1932‑BBGA (FCBGA) package, supplier device package listed as 1932‑FBGA, FC (45×45), in a surface-mount form factor for high-density board designs.
  • Power Supply  Core supply range specified from 820 mV to 880 mV, enabling designers to plan power delivery and sequencing around the device’s core voltage requirements.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
  • Regulatory Compliance  RoHS compliant.
  • Documentation  Stratix V device datasheet details electrical characteristics, switching characteristics, transceiver specifications, and I/O timing to support design verification and integration.

Typical Applications

  • High-density digital integration  Leverage the device’s large logic element count and embedded memory to consolidate multiple functions into a single FPGA for system integration and customization.
  • Multi‑interface bridging  Use the extensive I/O complement (840 I/Os) to implement protocol bridging, parallel interfaces, or numerous sensor/actuator connections on one FPGA.
  • High‑performance data paths  Large on-chip RAM and abundant logic resources enable wide datapath implementations, buffering, and local processing for demanding data-flow tasks.

Unique Advantages

  • High logic capacity: 583,000 logic elements accommodate large, complex designs and allow for tight functional consolidation.
  • Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependence on external memory for many buffering and LUT tasks.
  • Extensive I/O availability: 840 I/Os provide flexibility to connect multiple peripherals, interfaces, and high-pin-count subsystems without external I/O expanders.
  • Compact, manufacturable package: 1932‑BBGA (FCBGA) surface-mount package supports high-density PCB routing while maintaining a known mechanical footprint (1932‑FBGA, FC (45×45)).
  • Commercial temperature rating: Operation from 0 °C to 85 °C aligns the device with standard commercial deployments and environments.
  • Standards‑aware sourcing: RoHS compliance simplifies environmental and regulatory planning for assemblies using this FPGA.

Why Choose 5SGSMD6N3F45C2LN?

The 5SGSMD6N3F45C2LN positions itself as a high‑density, commercially rated Stratix V GS FPGA suitable for designs that require a large number of logic elements, significant embedded memory, and a high I/O count within a compact FCBGA package. Its documented electrical and switching characteristics in the Stratix V family datasheet help engineers assess power, timing, and transceiver-related considerations during system design.

This device is appropriate for teams consolidating complex digital functions, implementing wide datapaths with on-chip memory, or deploying boards that demand many external interfaces while operating in commercial temperature ranges.

Request a quote or submit an inquiry to get pricing and availability information for 5SGSMD6N3F45C2LN and to discuss how this Stratix V GS FPGA can fit your next design.

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