5SGSMD6N2F45I3N

The 5SGSMD6N2F45I3N is a Stratix V GS family FPGA from Intel, provided in a high-density 1932-ball FCBGA package. It combines a large logic fabric with substantial embedded memory and a high I/O count for industrial-grade applications.

Designed for systems requiring extensive programmable logic, on-chip RAM, and broad connectivity, this device is specified for operation from -40 °C to 100 °C and supports a core voltage supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity — 583,000 logic elements (logic cells) to implement large-scale digital designs and complex algorithms.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density — 840 I/Os to support extensive peripheral and high-pin-count interfaces.
• Package & Mounting — 1932-ball BGA/FBGA (FCBGA) package in a 1932 footprint (1932-FBGA, FC (45×45)); surface-mount mounting type for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, suitable for industrial temperature environments.
• Low-Voltage Core — Core supply range of 820 mV to 880 mV for the device core power domain.
• Standards Compliance — RoHS compliant, meeting common environmental restriction requirements.
• Documentation Coverage — Part of the Stratix V family covered by device electrical and switching characteristic documentation, including I/O timing and power specifications.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded memory to implement complex signal processing, data-paths, or custom accelerators.
• Multi-channel I/O systems — Leverage 840 I/Os to connect to numerous peripherals, sensors, or board-level interfaces without external multiplexing.
• Industrial control and instrumentation — Industrial temperature rating and robust package mounting make this device suitable for control, monitoring, and automation systems that require programmable logic.

Unique Advantages

• High integration density: 583,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory supports large buffering and deterministic on-chip storage for data-intensive designs.
• Extensive I/O capability: 840 I/Os simplify system routing and allow direct interfacing to a wide range of peripherals and daughter cards.
• Industrial operating range: Specified operation from -40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact board-level integration: 1932-ball FCBGA packaging and surface-mount mounting reduce board area for dense system designs.
• RoHS compliant: Meets environmental restriction requirements for modern electronic products.

Why Choose 5SGSMD6N2F45I3N?

The 5SGSMD6N2F45I3N positions itself as a high-capacity Stratix V GS FPGA offering a balance of logic resources, embedded memory, and I/O density in a single industrial-grade package. It is well suited for engineers and procurement teams building systems that require scalable programmable logic, significant on-chip RAM, and broad interfacing capability.

Backed by Stratix V family documentation, this device provides verifiable electrical and switching characteristics and is appropriate for designs where long-term availability, integration density, and temperature robustness are key selection criteria.

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