5SGSMD6N3F45I3LG

The 5SGSMD6N3F45I3LG is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 1932-BBGA FCBGA package. It delivers a high combination of logic capacity, embedded memory, and I/O density tailored for complex, high-density digital designs.

Designed for industrial-grade applications, this device combines 583,000 logic elements, approximately 46 Mbits of on-chip RAM, and 840 user I/Os in a surface-mount 1932-FBGA (45×45) footprint, with a specified core voltage window and extended operating temperature range.

Key Features

• Core Capacity  583,000 logic elements (cells) to implement large-scale programmable logic and complex custom functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM (46,080,000 bits) for data buffering, local storage, and high-throughput state machines.
• I/O Density  840 user I/Os to support multiple parallel interfaces, dense connector routing, and mixed-signal front-end integration.
• Power and Voltage  Specified core supply range from 820 mV to 880 mV to match platform power-rail requirements and power-management strategies.
• Package & Mounting  1932-BBGA (FCBGA) / supplier package 1932-FBGA, FC (45×45); surface-mount for compact, high-density PCB assembly.
• Industrial Temperature Grade  Rated for –40 °C to 100 °C operating temperature, suitable for extended-environment deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density custom logic and acceleration  Use the 583,000 logic elements and substantial on-chip RAM to implement large custom datapaths, accelerators, and protocol handlers.
• Multi-interface, high-pin-count systems  840 I/Os enable aggregation of multiple parallel interfaces, dense sensor arrays, or extensive peripheral connectivity on a single device.
• Industrial and embedded systems  Industrial temperature rating (–40 °C to 100 °C) supports deployment in factory automation, test equipment, and other rugged applications.
• Space-constrained, high-integration boards  1932-BBGA FCBGA package and surface-mount mounting allow compact PCB layouts where board area and routing density are at a premium.

Unique Advantages

• Massive logic resources: 583,000 logic elements provide the capacity needed for complex state machines, custom accelerators, and large FPGA designs, reducing the need for multiple devices.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM lowers external memory dependency and simplifies high-bandwidth buffering and local storage.
• Exceptional I/O count: 840 user I/Os enable broad interface consolidation and flexible pin assignment for multi-protocol systems.
• Industrial-grade thermal range: –40 °C to 100 °C operation supports reliable field deployment in demanding environments.
• Compact, manufacturable package: 1932-BBGA (45×45) surface-mount package provides high integration density for space-constrained designs.
• Controlled core-voltage range: 820 mV to 880 mV core supply specification helps align power delivery and system-level power management.

Why Choose 5SGSMD6N3F45I3LG?

The 5SGSMD6N3F45I3LG combines large logic capacity, significant embedded memory, and a very high I/O count in a single industrial-grade FCBGA package, making it suitable for designers who need dense programmable logic and extensive interfaces in compact, rugged systems. Its specified voltage and temperature ranges, along with RoHS compliance, support integration into industrial platforms where environmental range and regulatory compliance matter.

This device is positioned for teams building complex FPGA-based systems that require scalability of logic and memory without sacrificing I/O density or board-area efficiency, and who will leverage Stratix V family documentation for detailed electrical and timing specifications.

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