5SGSMD6N3F45I3G

The 5SGSMD6N3F45I3G is a Stratix V GS family Field Programmable Gate Array (FPGA) in a 1932‑BBGA FCBGA package. It delivers large programmable logic capacity, extensive embedded memory, and a high I/O count for industrial-grade applications.

Designed for systems that require significant on-chip resources and robust environmental tolerance, this device combines approximately 583,000 logic elements with roughly 46 Mbits of embedded RAM and up to 840 I/O to support complex digital designs.

Key Features

• Logic Capacity  Approximately 583,000 logic elements (cells) to implement dense, complex logic and custom hardware functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, state storage, and data-path implementation.
• High I/O Count  Up to 840 I/O pins to support wide parallel interfaces and rich system connectivity.
• Industrial Grade  Rated for industrial temperature operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Power and Supply  Core voltage supply range of 820 mV to 880 mV for defined power planning and board-level integration.
• Package & Mounting  1932‑BBGA, FCBGA package (supplier package: 1932‑FBGA, FC 45×45) with surface‑mount mounting for high-density PCB assembly.
• Regulatory Status  RoHS compliant.
• Family Context  Part of the Stratix V family; the Stratix V device datasheet provides detailed electrical and switching characteristics for design reference.

Typical Applications

• Industrial Control  Implement complex control logic, real‑time processing, and large I/O interfacing within industrial temperature ranges.
• Signal Processing  On‑chip RAM and extensive logic resources support buffering, data path pipelines, and custom acceleration blocks.
• Data Acquisition & Aggregation  High I/O count enables wide parallel sensor or interface connections and flexible protocol handling.

Unique Advantages

• Large Programmable Resource Pool: Approximately 583,000 logic elements provide headroom for complex custom logic and feature-rich designs.
• Significant Embedded Memory: Roughly 46 Mbits of on‑chip RAM reduces dependence on external memory for mid‑sized buffering and scratch storage.
• High I/O Density: Up to 840 I/O pins simplify board-level routing for multi‑channel interfaces and parallel connectivity.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature‑variable environments.
• Compact, High‑Density Package: 1932‑BBGA FCBGA packaging enables a high resource count in a compact form factor for constrained PCB area.
• RoHS Compliance: Helps meet regulatory requirements for environmentally conscious product designs.

Why Choose 5SGSMD6N3F45I3G?

The 5SGSMD6N3F45I3G pairs large logic capacity and substantial embedded memory with a very high I/O count and industrial temperature rating, making it well suited to designs that demand on‑chip integration and robust operation. Its 1932‑BBGA FCBGA package supports dense system implementations where board space is constrained but resource requirements are high.

This device is appropriate for engineering teams building complex digital systems—where scalability of programmable logic, on‑chip memory resources, and reliable operation across a wide temperature range are primary considerations.

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