5SGSMD6N3F45I4N

The 5SGSMD6N3F45I4N is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel. It combines high logic capacity, substantial on-chip RAM, and a large I/O complement in a 1932-ball FCBGA package to address complex programmable logic designs.

Designed for applications that require dense programmable logic, significant embedded memory, and extensive I/O connectivity, this device delivers a balance of integration and industrial-temperature robustness suitable for demanding system designs.

Key Features

• High-density programmable logic  Provides 583,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory dependence.
• Extensive I/O  840 I/Os for high-pin-count interfaces and flexible board-level connectivity.
• Core power envelope  Operates from a core voltage supply range of 820 mV to 880 mV to meet specific power-domain requirements.
• Industrial temperature grade  Rated for operation from –40 °C to 100 °C for deployment in industrial-temperature environments.
• Package and mounting  Available in a 1932-BBGA / 1932-FBGA (45×45) FCBGA package and intended for surface-mount assembly.
• Regulatory compliance  RoHS-compliant construction.

Typical Applications

• High-density digital processing  Implement large custom datapaths and parallel processing engines using the device's extensive logic resources.
• Memory-intensive functions  Leverage approximately 46.08 Mbits of embedded RAM for buffering, caching, and table-based operations.
• I/O-heavy interfaces  Use the 840 I/Os for SOC bridging, multi-protocol interfacing, and high-pin-count system I/O tasks.
• Industrial systems  Deploy in industrial-temperature applications that require operation across –40 °C to 100 °C.

Unique Advantages

• Substantial logic density: The 583,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Large on-chip memory: Approximately 46.08 Mbits of embedded RAM decreases reliance on external memory, simplifying board design and improving latency for internal buffering.
• High I/O capacity: 840 available I/Os provide flexibility for dense front-end interfaces, multi-lane connectivity, or extensive sensor and control I/O.
• Industrial temperature support: Rated for –40 °C to 100 °C, making the device suitable for a broad range of temperature-challenging deployments.
• Compact, high-pin-count package: The 1932-ball FCBGA (45×45) package delivers the pin density required for high-performance designs while supporting surface-mount integration.
• RoHS compliance: Meets lead-free environmental compliance requirements for modern manufacturing processes.

Why Choose 5SGSMD6N3F45I4N?

The 5SGSMD6N3F45I4N from Intel’s Stratix V GS family pairs very high logic capacity with substantial embedded memory and a large I/O footprint, making it a strong candidate for designs that require consolidation of complex digital functions and large on-chip data storage. Its industrial temperature rating and surface-mount FCBGA packaging support deployment in demanding environments where reliability and integration density matter.

This device is suitable for engineering teams building systems that need scalable programmable logic, significant embedded RAM, and wide I/O coverage in a single FPGA package.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSMD6N3F45I4N for your next high-density FPGA design.