5SGSMD8N2F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,107 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N2F45C2LN – Stratix® V GS FPGA (695,000 logic elements, 1932‑BBGA)

The 5SGSMD8N2F45C2LN is a Stratix® V GS field‑programmable gate array (FPGA) in a 1932‑ball BGA FCBGA package. It delivers very high logic capacity and on‑chip memory with an extensive I/O count in a surface‑mount package for commercial‑grade applications.

Designed for high‑density digital implementation, this device targets designs that require large logic resources, substantial embedded RAM, and a high number of I/O connections while operating within commercial temperature and low‑voltage core ranges.

Key Features

  • High logic capacity  Approximately 695,000 logic elements to accommodate complex digital designs and large integration of functions on a single device.
  • Embedded memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and state storage in memory‑intensive designs.
  • Extensive I/O  840 user I/O pins enabling dense external connectivity for parallel buses, multiple interfaces, and board‑level integration.
  • Core supply  Specified operating supply range of 820 mV to 880 mV (0.82–0.88 V), consistent with low‑voltage FPGA core requirements.
  • Package and mounting  1932‑BBGA / FCBGA (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor for high‑density PCB assembly.
  • Commercial temperature grade  Rated for operation from 0 °C to 85 °C for commercial applications.
  • RoHS compliant  Manufactured to meet RoHS requirements for environmental compliance.

Typical Applications

  • High‑density digital systems  Use the large logic resource pool to implement complex state machines, datapath logic, and custom accelerators on a single device.
  • Memory‑intensive designs  Leverage approximately 51.2 Mbits of embedded RAM for FIFOs, buffering, and table storage in streaming or DSP support functions.
  • I/O‑rich platforms  Deploy in systems requiring many parallel or multiplexed interfaces thanks to the device's 840 I/O pins.

Unique Advantages

  • Large single‑device integration: 695,000 logic elements reduce the need for multiple FPGAs, simplifying board design and lowering BOM complexity.
  • Substantial on‑chip RAM: Approximately 51.2 Mbits of embedded memory enables on‑device buffering and data staging without relying on external memory for many use cases.
  • High I/O count: 840 I/O pins provide flexibility for interfacing to multiple peripherals, parallel buses, and high‑pin‑count daughtercards.
  • Compact form factor: 1932‑ball FCBGA package delivers high density in a surface‑mount package suitable for space‑constrained PCBs.
  • Commercial operating profile: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial deployments.

Why Choose 5SGSMD8N2F45C2LN?

This Stratix® V GS FPGA balances very large logic resources, substantial embedded memory, and a high I/O count in a single commercial‑grade FCBGA package. It is well suited for engineers and teams implementing large, integrated digital systems that require dense logic, significant on‑chip RAM, and broad external connectivity while operating within standard commercial temperature ranges.

As part of the Stratix V device family, the 5SGSMD8N2F45C2LN is supported by family documentation and specifications that help accelerate design planning and validation for high‑density FPGA applications.

If you would like pricing, availability, or a formal quote for 5SGSMD8N2F45C2LN, submit a request or quote inquiry and our team will respond with the next steps and lead‑time information.

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