5SGSMD8N2F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 617 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N2F45C2N – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSMD8N2F45C2N is a Stratix V GS family FPGA in a 1932-BBGA (FCBGA) package, offered as a commercial-grade device. It delivers high logic density and on-chip RAM to support complex programmable logic implementations while providing a broad I/O count for system-level integration. Key attributes include 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os, with surface-mount packaging and a commercial operating temperature range.

Key Features

  • Logic Capacity  695,000 logic elements to implement large, complex digital designs and densely packed logic functions.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic.
  • I/O Density  840 I/Os to support extensive peripheral, bus, and multi-channel interfacing from a single device.
  • Package & Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), designed for surface-mount PCB assembly.
  • Power  Core/voltage supply specified at 870 mV to 930 mV to match designed FPGA power rails and system power sequencing.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for mainstream embedded and enterprise applications.
  • Standards Compliance  RoHS compliant, meeting common environmental and lead-free assembly requirements.

Unique Advantages

  • High integration density: 695,000 logic elements plus sizable embedded RAM reduce external component count and simplify board-level design.
  • Extensive I/O capability: 840 I/Os provide flexibility to consolidate multiple interfaces and peripherals directly to the FPGA.
  • Compact, manufacturable package: 1932-BBGA FCBGA in a 45×45 footprint supports high-pin-count designs while enabling surface-mount production.
  • Commercial temperature rating: Rated 0 °C to 85 °C to align with standard commercial deployments and system thermal profiles.
  • Defined core voltage range: 870 mV to 930 mV supply specification aids in power supply design and sequencing for the device core.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing flows and common environmental requirements.

Why Choose 5SGSMD8N2F45C2N?

The 5SGSMD8N2F45C2N positions itself as a high-capacity Stratix V GS FPGA for commercial designs requiring substantial logic resources, embedded memory, and a large number of I/Os in a single, surface-mount package. Its combination of 695,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os makes it suitable for complex, integration-focused projects where consolidation and routing density matter.

Choosing this device offers designers predictable electrical parameters—including a defined core voltage range and a commercial operating temperature—backed by RoHS compliance and the established Stratix V device family datasheet guidance.

Request a quote or submit an inquiry to receive availability and pricing information for the 5SGSMD8N2F45C2N.

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