5SGSMD8N2F45I2G

The 5SGSMD8N2F45I2G is an Intel Stratix V GS FPGA offered in an industrial temperature grade and a 1932-BBGA (FCBGA) package. It provides high logic density, abundant on‑chip memory, and a large I/O count for complex, system‑level FPGA designs.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/O pins, this device targets high‑capacity digital designs that require significant logic, memory, and interfacing capability while operating over an industrial temperature range.

Key Features

• Logic Capacity  695,000 logic elements to implement large, complex logic designs and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM (51,200,000 bits) to support large data buffers, state machines, and storage for high‑throughput data paths.
• High I/O Count  Up to 840 I/O pins to support dense interfacing, multiple high‑pin peripherals, and complex board-level connectivity.
• Package & Mounting  1932‑BBGA (FCBGA) supplier package (1932‑FBGA, FC, 45×45) with surface‑mount mounting for compact, high‑pin‑count board designs.
• Voltage Range  Core supply range of 870 mV to 930 mV to match system power architectures and core voltage requirements.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive industrial environments.

Typical Applications

• Large‑scale digital processing  Implement high‑density logic and custom compute pipelines using 695,000 logic elements and substantial embedded memory.
• Memory‑intensive designs  Leverage approximately 51.2 Mbits of on‑chip RAM for buffering, packet queues, and large state storage.
• High‑pin peripheral systems  Support extensive external interfacing and parallel IO requirements with up to 840 I/O pins.
• Industrial deployments  Use in temperature‑challenging environments thanks to the −40 °C to 100 °C operating range and industrial grade classification.

Unique Advantages

• High integration density: 695,000 logic elements reduce the need for multiple devices by consolidating logic into a single FPGA.
• Large embedded memory: Approximately 51.2 Mbits of RAM enables on‑chip data processing and minimizes external memory dependence.
• Extensive I/O capability: 840 I/O pins simplify board design for multi‑interface and high‑parallelism systems.
• Industrial temperature support: Rated for −40 °C to 100 °C to meet demanding environmental requirements.
• Compact, high‑pin package: 1932‑BBGA (45×45) FCBGA package delivers a dense pinout in a surface‑mount form factor for space‑constrained designs.
• Defined core voltage range: 870 mV to 930 mV core supply window aligns with low‑voltage FPGA core power domains.

Why Choose 5SGSMD8N2F45I2G?

The 5SGSMD8N2F45I2G combines high logic density, substantial embedded memory, and a very large I/O complement in an industrial‑grade Stratix V GS device and a 1932‑BBGA package. This configuration is suitable for designers who need to consolidate complex logic, memory, and interfacing into a single, temperature‑hardened FPGA solution.

As part of the Stratix V family, the device is documented within the Stratix V device datasheet and related Intel/Altera technical documentation, providing a clear set of electrical and operating characteristics to support system integration and long‑term product development.

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