5SGSMD8N2F45I3G

The 5SGSMD8N2F45I3G is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, offering a high-density programmable logic platform in a 1932-BBGA FCBGA package. This industrial-grade device combines a large logic fabric, substantial on-chip memory, and a very high I/O count for demanding embedded and system-level designs.

Designed for applications that require extensive custom logic and I/O integration under industrial temperature conditions, the device provides a defined core voltage range and is RoHS compliant. The Stratix V family documentation included with the device covers electrical and switching characteristics relevant to system design and integration.

Key Features

• Core Logic 695,000 logic elements for implementing large-scale custom digital functions and complex state machines.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, LUTs, and embedded data storage without external memory dependence.
• I/O Density 840 I/O pins to support extensive peripheral, sensor, and high-density interface requirements.
• Package & Mounting 1932-BBGA (FCBGA) package; supplier device package specified as 1932-FBGA, FC (45×45). Surface-mount mounting type for PCB assembly.
• Power Supply Core voltage supply range of 820 mV to 880 mV (0.82–0.88 V) for the device core.
• Industrial Temperature Grade Rated operating temperature from −40 °C to 100 °C for industrial-environment deployments.
• Standards Compliance RoHS compliant to meet common environmental and manufacturing requirements.
• Stratix V Family Documentation Electrical and switching characteristics, I/O timing, and transceiver-related details are covered in the Stratix V device datasheet for system-level design reference.

Typical Applications

• Industrial Control & Automation Industrial-grade temperature range and high I/O count make the device suitable for complex control logic and distributed I/O aggregation.
• High-Density Interface Bridging Large I/O complement supports protocol bridging, front-end aggregation, and system I/O consolidation on a single device.
• Compute Acceleration & Custom Logic High logic element count and substantial embedded memory enable implementation of data-path accelerators, custom DSP, and parallel processing engines.
• Telecommunications & Network Infrastructure Stratix V family documentation includes transceiver and I/O timing guidance for designs requiring advanced signaling and interface timing control.

Unique Advantages

• Highly Integrated Logic and Memory: 695,000 logic elements combined with approximately 51.2 Mbits of on-chip RAM reduce the need for external logic and memory components.
• Extensive I/O Capacity: 840 I/O pins allow consolidation of multiple interfaces and simplify board-level routing for dense connectivity requirements.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployments in demanding temperature environments.
• Compact, High-Pin-Count Packaging: 1932-BBGA FCBGA in a 45×45 supplier footprint delivers high pin count in a compact surface-mount form factor.
• Controlled Core Voltage Range: Defined 0.82–0.88 V supply range supports predictable power budgeting for system design.
• RoHS Compliant: Meets common environmental compliance requirements for modern manufacturing.

Why Choose 5SGSMD8N2F45I3G?

The 5SGSMD8N2F45I3G is positioned for designers who need a high-density FPGA with a large logic fabric, significant embedded memory, and very high I/O count, while operating across industrial temperature ranges. Its defined core voltage range and BGA packaging support integration into power-optimized, space-constrained systems.

Backed by Stratix V family documentation from Intel, the device is suitable for customers building scalable, robust FPGA-based systems that require consolidated logic, memory, and I/O resources on a single industrial-grade component.

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