5SGSMD8N2F45I2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 93 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N2F45I2LN – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSMD8N2F45I2LN is a Stratix V GS family FPGA offering high logic capacity and on-chip memory for industrial applications. As a high-density, industrial-grade FPGA in a 1932-BBGA FCBGA package, it targets designs that require substantial logic resources, extensive I/O, and operation across a wide temperature range.

With 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 user I/Os, this device is engineered to deliver large-scale integration and system consolidation while operating from a core voltage range of 820 mV to 880 mV.

Key Features

  • Logic Capacity  695,000 logic elements provide a large fabric for implementing complex custom logic, datapaths, and state machines.
  • Logic Blocks  262,400 logic blocks support hierarchical design and resource partitioning for large designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM enables large buffers, FIFOs, and on-chip data storage without external memory dependence.
  • I/O Count  840 user I/Os accommodate wide parallel interfaces, multiple high-pin-count peripherals, and flexible board-level routing.
  • Power and Core Voltage  Core supply range of 820 mV to 880 mV supports operation within defined low-voltage FPGA core requirements.
  • Package and Mounting  1932-BBGA (FCBGA, 45×45) surface-mount package provides a high-pin-count footprint suitable for dense interconnect on multi-layer PCBs.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
  • Regulatory  RoHS compliant for lead-free assembly processes and environmental compliance.

Typical Applications

  • Industrial Control Systems  Implements complex control algorithms and large I/O interfacing where wide temperature range and high logic density are required.
  • Data Processing and Acceleration  Hosts large-scale datapaths and on-chip buffering using substantial logic resources and embedded RAM for low-latency processing.
  • Communications Infrastructure  Supports dense I/O and integration of protocol and framing logic for network and telecom equipment.
  • Test & Measurement Equipment  Enables custom signal conditioning, aggregation, and deterministic logic timing in industrial test systems.

Unique Advantages

  • High integration density: 695,000 logic elements and ~51.2 Mbits of embedded RAM reduce the need for external components and simplify system BOM.
  • Extensive I/O capability: 840 user I/Os allow direct interfacing to multiple peripherals and high-pin-count connectors without external multiplexing.
  • Industrial robustness: Specified for −40 °C to 100 °C operation to meet demanding environmental conditions in industrial deployments.
  • Compact, high-pin-count package: 1932-BBGA (FCBGA) delivers dense routing and signal integrity advantages for complex PCB designs.
  • Controlled core supply: Narrow core voltage range (820–880 mV) supports predictable power design and thermal planning.
  • RoHS compliant: Facilitates lead-free manufacturing and compliance with environmental regulations.

Why Choose 5SGSMD8N2F45I2LN?

The 5SGSMD8N2F45I2LN positions itself as a high-capacity, industrial-grade FPGA suitable for designs that demand large programmable logic fabrics, substantial on-chip memory, and broad I/O resources. Its combination of logic density, embedded RAM, and an extensive I/O set makes it well suited for consolidation of complex systems onto a single programmable device.

For engineering teams building industrial controls, communications equipment, or high-performance processing modules, this Stratix V GS device offers scalable resources, predictable operating voltage requirements, and a package tailored for high-pin-count board layouts—supporting long-term design stability and manufacturability.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the 5SGSMD8N2F45I2LN.

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