5SGSMD8N2F45I3LN

The 5SGSMD8N2F45I3LN is a Stratix V GS Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a high logic element count alongside substantial on-chip memory and a large I/O complement for dense system integration.

Packaged in a 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) and specified for industrial operation, this surface-mount device includes a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-challenged environments where component-level integration is required.

Key Features

• Core Logic Capacity 695,000 logic elements to implement large FPGA designs and complex logic structures.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM (51,200,000 bits) for buffering, pipeline storage, and LUT-based memory needs.
• I/O Density 840 available I/O pins to support broad peripheral connectivity and high-pin-count interfaces.
• Package & Mounting 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45); surface-mount construction for board-level integration.
• Power Core supply voltage range from 820 mV to 880 mV to match low-voltage platform requirements.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Compliance RoHS compliant.

Unique Advantages

• High-density integration: 695,000 logic elements enable complex, consolidated designs that reduce external component count.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffering and local data storage without relying on external memory.
• Extensive I/O availability: 840 I/Os provide flexibility to connect multiple high-pin-count interfaces and parallel subsystems directly to the FPGA.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for deployment in environments requiring extended temperature capability.
• Compact BGA footprint: 1932-BBGA FCBGA package (45×45) delivers high pin density in a board-mountable, surface-mount form factor.
• Regulatory alignment: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5SGSMD8N2F45I3LN?

The 5SGSMD8N2F45I3LN positions itself as a highly integrated Stratix V GS FPGA option for designs that require a large logic fabric, significant on-chip RAM, and a broad set of I/Os within an industrial temperature profile. Its low-voltage core supply and BGA packing enable compact board layouts while supporting dense digital integration.

This device is suited to teams and systems that need scalable logic resources and embedded memory on a surface-mount, RoHS-compliant FPGA platform backed by Intel's Stratix V family documentation and device-level specifications.

Request a quote or submit an RFQ referencing part number 5SGSMD8N2F45I3LN to start the procurement process or to obtain pricing and availability information.