5SGSMD8N3F45C2LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 626 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N3F45C2LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSMD8N3F45C2LG is a Stratix V GS family FPGA offering high on-chip logic and memory capacity in a surface-mount FCBGA package. It provides a large programmable fabric, extensive I/O, and the electrical and switching characteristics documented in the Stratix V device datasheet.

This commercial-grade device is specified for a 0 °C to 85 °C operating range and a core supply voltage range of 820 mV to 880 mV, making it suitable for designs that require dense programmable logic, substantial embedded memory, and high I/O counts within commercial temperature limits.

Key Features

  • Core & logic density  695,000 logic elements (LEs) provide a high-capacity programmable fabric for complex digital designs.
  • Embedded memory  Approximately 51.2 Mbits of on-chip RAM for deep buffering, large state machines, and memory-intensive logic functions.
  • I/O capacity  840 user I/Os to support dense board-level connectivity and high pin-count interfaces.
  • Package & mounting  1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), designed for surface-mount assembly.
  • Power  Core voltage supply specified from 820 mV to 880 mV to meet the device’s power requirements.
  • Temperature grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Standards & compliance  RoHS compliant per the product environmental specification.
  • Stratix V family characteristics  Device-level electrical, switching, transceiver, and I/O timing characteristics are defined in the Stratix V device datasheet.

Unique Advantages

  • High integration density: 695,000 logic elements and ~51.2 Mbits of embedded RAM reduce external component count for complex designs.
  • Extensive board connectivity: 840 I/Os provide flexibility to implement numerous parallel interfaces or high-pin-count peripherals.
  • Compact FCBGA package: 1932-BBGA package delivers high pin density in a surface-mount form factor for space-constrained boards.
  • Commercial-temperature suitability: Specified 0 °C to 85 °C operation for standard commercial applications.
  • Defined power envelope: Core supply range (820 mV–880 mV) enables predictable power delivery planning during system design.
  • Regulatory compliance: RoHS compliance supports environmentally constrained product requirements.

Why Choose 5SGSMD8N3F45C2LG?

The 5SGSMD8N3F45C2LG combines high logic capacity, substantial on-chip RAM, and a very large I/O count in a 1932-BBGA FCBGA package, offering a compact, highly integrated solution for designs that need considerable programmable resources within commercial temperature limits. Its electrical and switching behavior is documented in the Stratix V device datasheet, enabling engineering teams to plan power, I/O timing, and transceiver usage based on the vendor specifications.

This part is appropriate for development teams and product designers targeting high-density FPGA implementations that require predictable power characteristics, defined temperature operation, and RoHS compliance, backed by the Stratix V device documentation.

Request a quote or submit an inquiry to obtain availability, lead times, and pricing for the 5SGSMD8N3F45C2LG.

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