5SGSMD8N3F45C2N

The 5SGSMD8N3F45C2N is an Intel Stratix® V GS field-programmable gate array (FPGA) in a high-density FCBGA package. It integrates approximately 695,000 logic elements and roughly 51.2 Mbits of embedded RAM to support complex, large-scale programmable logic implementations.

Designed for commercial-grade systems, this surface-mount device provides 840 user I/O pins and operates from a 0.87–0.93 V supply with an operating temperature range of 0 °C to 85 °C. The device ships in a 1932-BBGA (1932-FBGA, FC 45×45) package and is RoHS compliant.

Key Features

• Core Logic Density  Approximately 695,000 logic elements to implement complex digital logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet memory, and large LUT-based structures.
• I/O Capacity  840 user I/O pins to support wide parallel interfaces, high-pin-count peripherals, and substantial connectivity requirements.
• Power  Specified core supply range of 0.87 V to 0.93 V for the device core voltage domain.
• Package & Mounting  1932-BBGA FCBGA package (1932-FBGA, FC 45×45) in a surface-mount form factor for high-pin-count board designs.
• Operating Conditions & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale custom logic, signal processing pipelines, and complex control systems using extensive logic and memory resources.
• I/O-intensive platforms — Aggregate and route wide parallel interfaces or numerous peripherals using the device’s 840 I/O pins.
• Prototyping and system integration — Use the Stratix V GS device to prototype advanced FPGA-based subsystems that require substantial on-chip RAM and logic element capacity.

Unique Advantages

• High logic capacity: 695,000 logic elements enable implementation of complex functions and multi-module designs on a single device.
• Large embedded memory: Approximately 51.2 Mbits of RAM reduces external memory dependency and simplifies board-level memory architectures.
• Extensive connectivity: 840 I/O pins allow broad interfacing options and support high-density board designs without external I/O expanders.
• Compact high-pin-count package: 1932-BBGA FCBGA (45×45) delivers large pin-count in a surface-mount package suitable for dense PCBs.
• Commercial operating range: Rated for 0 °C to 85 °C and commercial-grade deployment where that temperature window is required.
• Standards-friendly compliance: RoHS compliance supports designs targeted at regions or programs that require restricted-substance adherence.

Why Choose 5SGSMD8N3F45C2N?

The 5SGSMD8N3F45C2N brings substantial programmable logic and embedded memory capacity in a single Stratix V GS device, making it well suited to designers who need to consolidate large digital functions and extensive I/O on one FPGA. Its FCBGA footprint supports high pin-count board designs while the defined core voltage range and commercial temperature grade provide clear electrical and environmental parameters for system integration.

This device is appropriate for engineering teams building high-density, I/O-rich digital subsystems that benefit from significant on-chip RAM and logic resources. As part of the Stratix V family, it aligns with device-level documentation for electrical and switching characteristics to aid in design and validation.

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