5SGSMD8N3F45C4G

The 5SGSMD8N3F45C4G is a Stratix® V GS Field Programmable Gate Array (FPGA) from Intel. It delivers high programmable logic capacity together with substantial embedded memory and a large I/O complement in a 1932‑BBGA FCBGA package.

Key device characteristics include 695,000 logic elements, approximately 51.2 Mbits of on‑chip RAM, 840 I/O pins, a core voltage supply range of 820 mV to 880 mV, and commercial temperature operation from 0 °C to 85 °C—attributes suited to high‑density, I/O‑intensive FPGA designs.

Key Features

• Core Logic  695,000 logic elements for implementing large-scale programmable digital designs.
• Embedded Memory  Approximately 51.2 Mbits of total on‑chip RAM to support buffering, state storage, and memory‑intensive logic functions.
• I/O Density  840 user I/O pins to accommodate dense peripheral interfacing and multi‑channel connectivity.
• Power  Core voltage supply range of 820 mV to 880 mV to match platform power architectures.
• Package & Mounting  1932‑BBGA (FCBGA); supplier device package listed as 1932‑FBGA, FC (45×45). Surface‑mount mounting type.
• Operating Temperature & Grade  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital systems  Use the large logic capacity and embedded RAM to map complex RTL, parallel datapaths, and state machines.
• I/O‑intensive designs  Leverage 840 I/O pins for dense external interfacing, multi‑channel interfaces, and board‑level connectivity.
• Platform prototyping and integration  High logic and memory capacity in a compact FCBGA package supports board‑level prototypes and systems with constrained PCB area.

Unique Advantages

• Large programmable capacity: 695,000 logic elements plus ~51.2 Mbits of embedded memory enable implementation of substantial custom logic and buffering on a single device.
• High I/O count: 840 I/O pins reduce the need for external multiplexing and simplify routing for multi‑channel systems.
• Compact advanced package: 1932‑BBGA (45×45 supplier footprint) provides a high‑density mounting option for space‑constrained boards.
• Commercial temperature operation: Specified 0 °C to 85 °C operation aligns with standard commercial deployment environments.
• Low‑voltage core: 820–880 mV core supply range supports integration with modern low‑voltage power rails.
• RoHS compliant: Conforms to lead‑free material requirements for environmentally conscious designs.

Why Choose 5SGSMD8N3F45C4G?

The 5SGSMD8N3F45C4G combines high logic density, substantial embedded memory, and a very large I/O count in a compact 1932‑BBGA FCBGA package, making it a practical choice for designs that demand on‑chip capacity and dense external interfacing within commercial temperature ranges. Its specified core voltage range and RoHS compliance support integration into modern platform architectures.

Designers can reference the Stratix V device datasheet for detailed electrical and switching characteristics to aid integration and system validation. This device is suited to teams implementing large FPGA designs that require scalable logic resources, significant on‑chip RAM, and high I/O density.

Request a quote or submit a purchase inquiry for 5SGSMD8N3F45C4G through your preferred procurement channel, quoting the full part number and desired quantity.