5SGSMD8N3F45I3L

The 5SGSMD8N3F45I3L is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package targeted for transceiver‑centric, DSP‑intensive designs. Built on a 28‑nm process, this device combines high logic density, abundant embedded memory, and integrated transceivers to address demanding wireline, broadcast, military, and high‑performance computing applications.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory and support for high-speed transceivers, the part is positioned to deliver the compute and I/O bandwidth required for complex packet processing, signal processing, and optical/backplane interface functions while operating across an industrial temperature range.

Key Features

• Core Technology – 28‑nm TSMC process architecture with the Stratix V family design elements, including redesigned adaptive logic modules (ALMs) and a comprehensive fabric clocking network.
• Logic Capacity – 695,000 logic elements for large, complex FPGA implementations and system integration on a single device.
• Embedded Memory – Approximately 51.2 Mbits of on‑chip RAM (M20K embedded memory blocks) to support buffering, lookup tables, and data‑centric processing.
• DSP Resources – Variable precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision digital signal processing workloads.
• High‑Speed Transceivers – Integrated transceiver capability (Stratix V GS variant) with 14.1‑Gbps data‑rate support for backplane and optical interface applications.
• I/O Density – 840 user I/Os to support broad external connectivity and multi‑lane interface implementations.
• Power Supply – Core operating voltage range of 820 mV to 880 mV to match system power‑rail architectures.
• Package & Mounting – 1932‑BBGA (FCBGA) package, supplier package noted as 1932‑FBGA (45×45), designed for surface‑mount PCB assembly.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C for deployment in industrial and rugged systems.
• Integration & Hard IP – Stratix V family includes embedded hard IP blocks and an Embedded HardCopy Block for hardened IP instantiation of PCIe Gen configurations (as part of family capabilities).

Typical Applications

• Optical and Backplane Communications – High‑speed transceivers and dense I/O make this device suitable for backplane, optical transport and switch applications requiring multi‑lane interfaces.
• Digital Signal Processing & High‑Performance Computing – Large DSP block counts and substantial embedded memory support FFTs, filtering, and other compute‑intensive DSP pipelines.
• Military and Broadcast Systems – Industrial temperature rating, high logic density and deterministic DSP resources suit signal processing and data‑transport functions in tactical and broadcast equipment.
• Packet Processing & Network Equipment – High logic element count and abundant I/Os enable complex packet engines, traffic management and protocol processing implementations.

Unique Advantages

• High logic and I/O density: 695,000 logic elements and 840 I/Os provide the capacity to integrate multiple subsystems and high‑lane interfaces on a single device, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded memory supports large buffering and state‑storage demands for data‑intensive designs.
• Robust DSP capability: Variable precision DSP blocks with support for thousands of multipliers deliver performance for demanding signal‑processing tasks.
• Industrial temperature operation: −40 °C to 100 °C ratings allow deployment in harsh and industrial environments without derating system performance.
• Low‑voltage core operation: 0.82–0.88 V core supply range supports modern power architectures and efficient system power design.
• Path to production ASICs: Stratix V family documentation highlights a low‑risk path to HardCopy V ASICs for volume production (family‑level capability).

Why Choose 5SGSMD8N3F45I3L?

The 5SGSMD8N3F45I3L combines Stratix V GS family architecture with high logic density, large embedded memory and high‑speed transceiver support to address DSP‑centric and bandwidth‑heavy applications. Its industrial temperature rating and comprehensive on‑chip resources make it suitable for systems that require both compute density and robust I/O connectivity.

This FPGA is a strong candidate for engineers designing optical transport, packet processing, waveform processing, and other data‑intensive systems that benefit from integrated DSP blocks, substantial RAM, and a high pin count in a compact FCBGA package.

Request a quote or submit a procurement inquiry to get pricing, lead times, and availability for the 5SGSMD8N3F45I3L.