5SGSMD8N3F45I4

The 5SGSMD8N3F45I4 is a Stratix® V GS field programmable gate array (FPGA) in a 1932-ball FCBGA package, offered in an industrial temperature grade. This device provides large on-chip resources—including approximately 695,000 logic element cells and approximately 51.2 Mbits of embedded memory—making it suitable for complex, high-density FPGA implementations.

Built for demanding systems that require extensive I/O and configurable logic, the device combines high logic capacity, significant embedded RAM, and a wide I/O count with industrial-temperature operation and low-voltage core supply for modern system designs.

Key Features

• Logic Resources  Approximately 695,000 logic element cells and 262,400 logic elements provide substantial programmable fabric for complex logic, control, and datapath implementations.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
• I/O Capacity  840 I/O pins enable extensive external connectivity for multi-channel interfaces, large bus fabrics, and dense peripheral integration.
• Package and Mounting  1932-BBGA (FCBGA) package in a 45 × 45 mm footprint, surface-mount mounting type for compact, high-density board layouts.
• Power  Core voltage supply specified at 820 mV to 880 mV to match modern low-voltage power domains and support optimized power delivery designs.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for applications requiring extended temperature range performance.
• Compliance  RoHS compliant for global environmental standards.
• Stratix V Family Characteristics (datasheet)  Electrical and switching characteristics, including core and I/O timing and transceiver specifications, are covered in the Stratix V device documentation for design reference.

Typical Applications

• High-density FPGA systems  Large logic and memory resources make this device suitable for complex, multi-function FPGA implementations and prototype platforms that require extensive on-chip resources.
• High I/O-count interface control  With 840 I/O pins, the device supports designs that require dense external connectivity—such as multi-channel data aggregation, wide parallel buses, and extensive peripheral routing.
• Industrial and ruggedized equipment  Industrial temperature rating and surface-mount FCBGA package accommodate designs deployed in extended-temperature environments and industrial systems.

Unique Advantages

• High logic and memory density:  Combines roughly 695,000 logic element cells with approximately 51.2 Mbits of embedded RAM to consolidate functions that would otherwise require multiple devices.
• Extensive I/O integration:  840 I/Os reduce the need for external multiplexing or GPIO expanders, simplifying board design for I/O-heavy systems.
• Industrial temperature capability:  Rated for –40 °C to 100 °C to support deployment in temperature-challenging environments without derating system performance.
• Compact, production-ready package:  1932-ball FCBGA (45 × 45 mm) enables high-density PCB layouts while supporting robust surface-mount assembly processes.
• Low-voltage core operation:  820 mV to 880 mV core supply supports integration with modern low-voltage power architectures and optimized power distribution.
• Environmental compliance:  RoHS compliant to meet environmental and materials requirements in global manufacturing.

Why Choose 5SGSMD8N3F45I4?

The 5SGSMD8N3F45I4 is positioned for designs that demand large programmable logic capacity, substantial on-chip RAM, and a high I/O count in an industrial-temperature FPGA. Its combination of roughly 695,000 logic element cells, approximately 51.2 Mbits of embedded memory, and 840 I/Os addresses complex integration needs while the FCBGA package supports compact board implementations.

This device is well suited for engineering teams building high-density FPGA systems or industrial applications that require extended temperature operation, robust I/O, and significant on-chip resources. Its specification set aligns with designs that benefit from consolidation of functionality into a single programmable device, reducing board-level complexity and BOM count.

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