5SGSMD8N3F45I3LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 443 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N3F45I3LG – Stratix® V GS FPGA, 695,000 Logic Elements

The 5SGSMD8N3F45I3LG is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It provides a high-density programmable fabric with large on-chip memory and extensive I/O for complex, compute- and I/O-intensive designs.

Designed for industrial-grade applications, this device combines approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, and 840 user I/O to support high-capacity logic integration, memory buffering, and multi-channel interfacing in surface-mount board designs.

Key Features

  • High Logic Density — Approximately 695,000 logic elements and 262,400 logic array resources to implement complex digital designs and large-scale custom logic.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and local data storage without external memory dependency.
  • Extensive I/O — 840 user I/O pins to support multi-channel interfaces, wide buses, and high pin-count system connectivity.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring wide thermal tolerance.
  • Low-Voltage Supply — Operates from 820 mV to 880 mV, enabling integration into tightly constrained power domains.
  • Package and Mounting — Supplied in a 1932-BBGA (FCBGA) / 1932-FBGA, FC (45×45) package; surface-mount mounting for standard PCB assembly processes.
  • Compliance — RoHS-compliant manufacturing to meet environmental and regulatory requirements.

Typical Applications

  • High-density digital signal processing — Large logic capacity and substantial on-chip RAM support complex DSP pipelines and data-path implementations.
  • Network and communications systems — High I/O count and programmable fabric make it suitable for packet processing, protocol bridging, and custom interface logic.
  • Compute acceleration and prototyping — Use the device for hardware acceleration of algorithmic workloads and rapid prototyping of large-scale FPGA designs.

Unique Advantages

  • Significant on-chip resources: The combination of ~695,000 logic elements and ~51.2 Mbits of embedded RAM reduces reliance on external components and simplifies board-level memory architecture.
  • High I/O capacity: 840 I/O pins enable broad connectivity options for multi-channel and high-bandwidth system designs.
  • Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in demanding thermal environments.
  • Compact, high-pin-count package: 1932-BBGA / 1932-FBGA package offers dense integration for space-constrained PCBs while maintaining a large I/O complement.
  • Low-voltage core operation: 820–880 mV supply allows integration with modern low-voltage system power architectures.
  • RoHS-compliant: Manufactured to meet environmental standards required by many industrial and commercial projects.

Why Choose 5SGSMD8N3F45I3LG?

This Intel Stratix V GS FPGA is positioned for designs that demand a substantial programmable fabric, significant embedded memory, and a high pin count within a single surface-mount package. The device’s industrial temperature rating and RoHS compliance make it suitable for long-term deployments where environmental tolerance and regulatory compliance matter.

Choose the 5SGSMD8N3F45I3LG for projects that require scalable logic capacity, extensive I/O connectivity, and integrated memory resources to reduce BOM complexity and accelerate time-to-market for advanced digital and system-level designs.

Request a quote or submit an inquiry to receive pricing and lead-time information for the 5SGSMD8N3F45I3LG. Our team can provide specification support and availability details to help you plan your design.

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