5SGSMD8N3F45I3LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 443 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8N3F45I3LG – Stratix® V GS FPGA, 695,000 Logic Elements
The 5SGSMD8N3F45I3LG is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It provides a high-density programmable fabric with large on-chip memory and extensive I/O for complex, compute- and I/O-intensive designs.
Designed for industrial-grade applications, this device combines approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, and 840 user I/O to support high-capacity logic integration, memory buffering, and multi-channel interfacing in surface-mount board designs.
Key Features
- High Logic Density — Approximately 695,000 logic elements and 262,400 logic array resources to implement complex digital designs and large-scale custom logic.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and local data storage without external memory dependency.
- Extensive I/O — 840 user I/O pins to support multi-channel interfaces, wide buses, and high pin-count system connectivity.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring wide thermal tolerance.
- Low-Voltage Supply — Operates from 820 mV to 880 mV, enabling integration into tightly constrained power domains.
- Package and Mounting — Supplied in a 1932-BBGA (FCBGA) / 1932-FBGA, FC (45×45) package; surface-mount mounting for standard PCB assembly processes.
- Compliance — RoHS-compliant manufacturing to meet environmental and regulatory requirements.
Typical Applications
- High-density digital signal processing — Large logic capacity and substantial on-chip RAM support complex DSP pipelines and data-path implementations.
- Network and communications systems — High I/O count and programmable fabric make it suitable for packet processing, protocol bridging, and custom interface logic.
- Compute acceleration and prototyping — Use the device for hardware acceleration of algorithmic workloads and rapid prototyping of large-scale FPGA designs.
Unique Advantages
- Significant on-chip resources: The combination of ~695,000 logic elements and ~51.2 Mbits of embedded RAM reduces reliance on external components and simplifies board-level memory architecture.
- High I/O capacity: 840 I/O pins enable broad connectivity options for multi-channel and high-bandwidth system designs.
- Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in demanding thermal environments.
- Compact, high-pin-count package: 1932-BBGA / 1932-FBGA package offers dense integration for space-constrained PCBs while maintaining a large I/O complement.
- Low-voltage core operation: 820–880 mV supply allows integration with modern low-voltage system power architectures.
- RoHS-compliant: Manufactured to meet environmental standards required by many industrial and commercial projects.
Why Choose 5SGSMD8N3F45I3LG?
This Intel Stratix V GS FPGA is positioned for designs that demand a substantial programmable fabric, significant embedded memory, and a high pin count within a single surface-mount package. The device’s industrial temperature rating and RoHS compliance make it suitable for long-term deployments where environmental tolerance and regulatory compliance matter.
Choose the 5SGSMD8N3F45I3LG for projects that require scalable logic capacity, extensive I/O connectivity, and integrated memory resources to reduce BOM complexity and accelerate time-to-market for advanced digital and system-level designs.
Request a quote or submit an inquiry to receive pricing and lead-time information for the 5SGSMD8N3F45I3LG. Our team can provide specification support and availability details to help you plan your design.

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