5SGSMD8N3F45I3G

The 5SGSMD8N3F45I3G is a Stratix V GS field programmable gate array (FPGA) in a 1932-ball BGA FCBGA package. This industrial-grade device integrates high logic density, abundant I/O, and substantial on-chip RAM to support complex, programmable digital designs.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory and 840 user I/Os, the device is intended for designs that require large programmable logic capacity, significant on-chip storage and extensive external interfacing while operating within an industrial temperature range.

Key Features

• Core Logic  695,000 logic elements for implementing large-scale programmable logic and complex algorithms.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, state storage and intermediate processing without immediate reliance on external memory.
• I/O Capacity  840 I/O pins to accommodate high pin-count peripheral connectivity and multi-channel interfacing.
• Package & Mounting  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC, 45×45) with surface-mount mounting suitable for dense board-level integration.
• Power Supply  Core voltage supply range from 820 mV to 880 mV, enabling defined core power planning and supply design.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for deployment in temperature-demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic implementations  Use the device where large amounts of combinational and sequential logic are required on a single programmable fabric.
• I/O-intensive systems  Suitable for designs that require many external interfaces or parallel channel connectivity thanks to 840 I/Os.
• On-chip memory–dependent processing  Ideal for tasks that benefit from substantial embedded RAM for buffering, caching or intermediate data storage.
• Industrial embedded systems  Designed for industrial temperature operation and surface-mount integration in ruggedized or temperature-variable environments.

Unique Advantages

• High logic capacity: 695,000 logic elements enable complex logic integration on a single device, reducing the need for multiple FPGAs.
• Significant on-chip RAM: Approximately 51.2 Mbits of embedded memory help minimize external memory dependencies for many designs.
• Extensive I/O count: 840 I/Os provide flexibility for multi-channel and high-density interfacing without multiplexing compromises.
• Industrial temperature range: −40°C to 100°C rating supports deployment in environments with wide temperature swings.
• Compact, high-ball-count packaging: 1932-BBGA FCBGA (45×45) balances high pin count with board-level density for space-constrained systems.
• Defined core supply window: 820–880 mV core supply range simplifies power delivery design and thermal planning.

Why Choose 5SGSMD8N3F45I3G?

The 5SGSMD8N3F45I3G positions itself as a high-density, industrial-grade Stratix V GS FPGA for designers who need substantial logic capacity, large on-chip RAM and a very high I/O count in a single packaged device. Its defined core voltage range and broad operating temperature make it suitable for robust embedded designs that must remain reliable across varying environmental conditions.

This part is appropriate for engineering teams and procurement specialists seeking a programmable logic solution that consolidates complex functions on-chip, reduces board-level component count, and provides the resources required for sophisticated, I/O-rich designs while maintaining RoHS compliance.

Request a quote or submit a procurement inquiry to obtain pricing, lead time and availability for part number 5SGSMD8N3F45I3G.