5SGSMD8N3F45C3G

The 5SGSMD8N3F45C3G is a Stratix® V GS Field Programmable Gate Array (FPGA) from Intel, supplied in a 1932-ball FCBGA package. It delivers very high logic density and on-chip memory capacity, along with a large I/O count, intended for commercial-grade programmable logic applications.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory and 840 I/Os, this device is suited for designs that require extensive logic, significant embedded RAM and broad external connectivity while operating within a commercial temperature range.

Key Features

• Logic Capacity  695,000 logic elements to implement large, complex FPGA designs and high-density logic functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffer, lookup table and state-storage requirements without external memory.
• I/O Density  840 programmable I/Os to support wide parallel interfaces, multiple peripherals and high-pin-count system designs.
• Power/Core Supply  Specified core voltage supply range of 820 mV to 880 mV to match system power delivery and design constraints.
• Package and Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• Operating Temperature  Commercial-grade operation from 0 °C to 85 °C for typical commercial-environment deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density compute and acceleration  Use the device's large logic capacity and embedded RAM to implement custom accelerators and data-path processing within commercial equipment.
• Networking and packet processing  High I/O count and on-chip memory enable wide parallel interfaces and buffering for communication and switching platforms.
• Signal processing  Leverage extensive logic resources and embedded memory for DSP pipelines, filters and real-time data manipulation in commercial systems.
• Prototyping and system integration  A high-density FPGA option for integrating multiple system functions into a single programmable device during development and integration phases.

Unique Advantages

• Substantial logic resources: 695,000 logic elements provide headroom for complex designs and multi-function integration, reducing the need for discrete ASICs or multiple FPGAs.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM supports buffering and state retention for high-throughput data flows without external DRAM.
• Extensive I/O capability: 840 I/Os enable broad peripheral connectivity and parallel data interfaces, simplifying board-level routing for high-pin-count applications.
• Commercial-grade profile: Specified for 0 °C to 85 °C operation and RoHS compliance, aligning with standard commercial electronic product requirements.
• Compact FCBGA package: The 1932-ball FCBGA (45×45) package provides a high-density form factor suitable for space-constrained PCBs using standard surface-mount assembly.

Why Choose 5SGSMD8N3F45C3G?

This Stratix V GS FPGA balances very high logic density, substantial embedded memory and broad I/O capability in a single commercial-grade FCBGA package. It is positioned for engineers and system designers who need to consolidate complex digital functions, large buffering needs and multiple interfaces into a single programmable device while operating within standard commercial temperature and power envelopes.

Choosing this part supports scalable designs that require significant on-chip resources and flexible I/O mapping, backed by Intel’s Stratix V device family documentation and electrical characteristic specifications.

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