5SGSMD8N3F45C2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 413 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N3F45C2G – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD8N3F45C2G is a Stratix® V GS family field-programmable gate array (FPGA) IC from Intel supplied in a 1932-BBGA FCBGA package. It is a high-density commercial-grade FPGA targeted at designs that require large programmable logic capacity, substantial on-chip memory, and extensive I/O connectivity.

This device is offered as a surface-mount, commercial-grade FPGA and is suitable for applications where a combination of logic density, embedded memory, and a high I/O count are required within a single-package solution.

Key Features

  • Logic Capacity — 695,000 logic elements for implementing complex digital functions and large-scale custom logic.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
  • I/O Density — 840 general-purpose I/O pins to support broad interfacing and high pin-count system connectivity.
  • Package and Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for PCB integration.
  • Power — Core supply range of 0.87 V to 0.93 V to match system power domains and regulator designs.
  • Operating Range — Commercial-grade operation from 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 695,000 logic elements provide the capacity to implement large, complex FPGA designs without partitioning across multiple devices.
  • Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM enables large buffers, FIFOs, and memory-mapped logic structures within the FPGA fabric.
  • Extensive I/O count: 840 I/O pins support extensive external interfacing, enabling multi-channel connectivity and high-pin-count system designs.
  • Compact, high-pin-count package: The 1932-BBGA (FCBGA) package combines high routing density with a standardized form factor (1932-FBGA, FC 45×45) for board-level integration.
  • Controlled core voltage: A defined supply range of 0.87–0.93 V simplifies power-supply planning and core regulator selection.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for straightforward integration into commercial electronic products.

Why Choose 5SGSMD8N3F45C2G?

The 5SGSMD8N3F45C2G combines a very large logic fabric with substantial on-chip memory and a high I/O count in a single commercial-grade FCBGA package. These characteristics make it appropriate for designs that require dense programmable logic, embedded memory structures, and broad interfacing within a compact board footprint.

Backed by Intel’s Stratix V GS family documentation and offered in a standardized 1932-BBGA package, this FPGA is suited for engineering teams seeking a high-capacity, RoHS-compliant commercial FPGA platform with clearly defined electrical and mechanical parameters.

Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for the 5SGSMD8N3F45C2G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up