5SGSMD8N3F45C2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 413 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8N3F45C2G – Stratix® V GS Field Programmable Gate Array (FPGA)
The 5SGSMD8N3F45C2G is a Stratix® V GS family field-programmable gate array (FPGA) IC from Intel supplied in a 1932-BBGA FCBGA package. It is a high-density commercial-grade FPGA targeted at designs that require large programmable logic capacity, substantial on-chip memory, and extensive I/O connectivity.
This device is offered as a surface-mount, commercial-grade FPGA and is suitable for applications where a combination of logic density, embedded memory, and a high I/O count are required within a single-package solution.
Key Features
- Logic Capacity — 695,000 logic elements for implementing complex digital functions and large-scale custom logic.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
- I/O Density — 840 general-purpose I/O pins to support broad interfacing and high pin-count system connectivity.
- Package and Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for PCB integration.
- Power — Core supply range of 0.87 V to 0.93 V to match system power domains and regulator designs.
- Operating Range — Commercial-grade operation from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 695,000 logic elements provide the capacity to implement large, complex FPGA designs without partitioning across multiple devices.
- Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM enables large buffers, FIFOs, and memory-mapped logic structures within the FPGA fabric.
- Extensive I/O count: 840 I/O pins support extensive external interfacing, enabling multi-channel connectivity and high-pin-count system designs.
- Compact, high-pin-count package: The 1932-BBGA (FCBGA) package combines high routing density with a standardized form factor (1932-FBGA, FC 45×45) for board-level integration.
- Controlled core voltage: A defined supply range of 0.87–0.93 V simplifies power-supply planning and core regulator selection.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for straightforward integration into commercial electronic products.
Why Choose 5SGSMD8N3F45C2G?
The 5SGSMD8N3F45C2G combines a very large logic fabric with substantial on-chip memory and a high I/O count in a single commercial-grade FCBGA package. These characteristics make it appropriate for designs that require dense programmable logic, embedded memory structures, and broad interfacing within a compact board footprint.
Backed by Intel’s Stratix V GS family documentation and offered in a standardized 1932-BBGA package, this FPGA is suited for engineering teams seeking a high-capacity, RoHS-compliant commercial FPGA platform with clearly defined electrical and mechanical parameters.
Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for the 5SGSMD8N3F45C2G.

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