5SGSMD8N2F45I3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 852 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N2F45I3N – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSMD8N2F45I3N is a Stratix V GS family FPGA in a 1932-BBGA FCBGA package optimized for industrial applications. It provides large on-chip logic and memory resources with a broad I/O count and a low-voltage core supply, making it suitable for complex, board-level FPGA designs that require significant programmable logic and embedded memory.

Designed for industrial temperature operation, this device targets systems that need substantial logic capacity, extensive I/O, and a compact surface-mount package for high-density board integration.

Key Features

  • Logic Capacity — 695,000 logic elements providing a large programmable fabric for complex digital designs.
  • Logic Array Blocks — 262,400 logic array blocks to organize the device’s programmable resources efficiently.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, packet handling, and fast local storage.
  • I/O — 840 user I/O pins to support wide parallel interfaces, high-density connectivity, and multi-channel designs.
  • Power — Core voltage supply range of 820 mV to 880 mV to match platform power domains and optimize core power delivery.
  • Package & Mounting — 1932-BBGA (FCBGA) package, supplier package 1932-FBGA, FC (45×45); surface-mount mounting for compact PCB implementations.
  • Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployments in demanding environments.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • High-density data processing — Implement wide parallel datapaths and custom accelerators using the device’s large logic and memory resources.
  • Telecom and network equipment — Use the extensive I/O and embedded memory for packet buffering, protocol processing, and interface bridging.
  • Industrial control systems — Deploy in ruggedized control and automation equipment that requires industrial temperature operation and high integration.

Unique Advantages

  • Substantial programmable fabric: 695,000 logic elements enable implementation of large custom logic blocks and complex state machines.
  • Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency for latency-sensitive functions.
  • High I/O count: 840 I/Os support extensive peripheral interfaces and multi-lane connectivity without external expander logic.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in challenging thermal environments.
  • Compact surface-mount package: 1932-BBGA FCBGA provides high density in a single package for space-constrained PCBs.
  • Controlled core voltage range: 0.82–0.88 V core supply aligns with platform power management strategies.

Why Choose 5SGSMD8N2F45I3N?

The 5SGSMD8N2F45I3N positions itself as a high-capacity FPGA option within the Stratix V GS family, delivering a combination of large logic resources, substantial embedded memory, and a high pin-count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived, rugged applications that require reliable programmable logic with significant on-chip buffering and interfacing capabilities.

Engineers targeting complex signal processing, communications, or industrial control designs will find the device’s resource mix and package form factor appropriate for systems that demand integration density and robust operating temperature margins.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and additional procurement information for the 5SGSMD8N2F45I3N.

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