5SGSMD8N2F45I2N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,379 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8N2F45I2N – Stratix® V GS Field Programmable Gate Array (FPGA) IC
The 5SGSMD8N2F45I2N is a Stratix® V GS family FPGA delivering a large logic capacity and extensive I/O in a compact FCBGA package. It combines 695,000 logic elements with approximately 51.2 Mbits of embedded memory and 840 general‑purpose I/O to support complex logic integration and dense system designs.
Designed for industrial temperature operation, this device supports a core voltage range of 870 mV to 930 mV and is supplied in a 1932‑BBGA (1932‑FBGA, 45×45) package for surface‑mount assembly, enabling robust integration into high‑density boards.
Key Features
- Core Logic 695,000 logic elements for large-scale integration and complex logic implementation.
- Embedded Memory Approximately 51.2 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
- I/O Capacity 840 I/O pins to maximize connectivity for parallel peripherals, interfaces, and external devices.
- Power Supply Core supply range of 870 mV to 930 mV to match system power-rail designs requiring this operating window.
- Package & Mounting 1932‑BBGA / 1932‑FBGA (45×45) FCBGA package; surface‑mount device suitable for compact, high‑density PCB layouts.
- Temperature & Grade Industrial grade with an operating temperature range of −40°C to 100°C for deployment in temperature‑demanding environments.
- Compliance RoHS compliant to meet common environmental and safety directives for electronic components.
Unique Advantages
- Large on‑chip resources: The combination of 695,000 logic elements and ~51.2 Mbits of RAM reduces the need for external logic and memory, simplifying system BOM and PCB routing.
- Extensive I/O count: 840 I/O pins provide flexibility for complex interfacing requirements without additional I/O expanders.
- Industrial temperature support: Rated −40°C to 100°C for use in thermally demanding or outdoor installations where extended temperature range is required.
- Compact package density: The 1932‑FBGA (45×45) package enables high gate count in a single, board‑mountable package for dense system integration.
- Controlled core voltage range: The 870 mV–930 mV supply window supports consistent power delivery and predictable core operation across designs.
Why Choose 5SGSMD8N2F45I2N?
The 5SGSMD8N2F45I2N positions itself as a high‑density, industrial‑grade Stratix V GS FPGA suitable for designs that require substantial logic capacity, significant embedded memory, and broad I/O connectivity in a single device. Its FCBGA package and surface‑mount form factor enable compact board layouts while maintaining robust thermal and electrical characteristics.
Choose this device when you need a single‑chip solution to consolidate complex functions, reduce external components, and maintain operation across a wide temperature range—backed by the Stratix V family’s documented electrical characteristics and device specifications.
Request a quote or submit an RFQ to receive pricing, lead‑time, and availability details for the 5SGSMD8N2F45I2N. Our team will respond with the information needed to move your design forward.

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