5SGSMD8N2F45I3LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,818 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N2F45I3LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

The 5SGSMD8N2F45I3LG is a Stratix V GS series field programmable gate array (FPGA) offered in a 1932-ball FCBGA package. This device integrates a large programmable fabric with substantial embedded memory and a high I/O count for complex digital designs.

With 695,000 logic elements and approximately 51.2 Mbits of embedded memory, the device targets industrial applications that require high logic capacity, dense I/O, and extended operating temperature capability. The device is specified for a core supply voltage range of 820 mV to 880 mV and an operating temperature range of −40°C to 100°C.

Key Features

  • Core Logic  695,000 logic elements provide a large programmable fabric for complex logic, signal processing, and system integration tasks.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and on-chip data paths.
  • I/O and Package  840 user I/O pins in a 1932-ball BGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45), optimized for high-density board designs.
  • Power  Core supply voltage range of 820 mV to 880 mV to support the device's operating requirements.
  • Thermal and Environmental  Industrial operating temperature range of −40°C to 100°C for deployment in temperature-variable environments; RoHS compliant.
  • Mounting  Surface-mount package suitable for modern PCB assembly workflows.

Unique Advantages

  • Large programmable capacity: 695,000 logic elements enable integration of complex systems and consolidation of multiple functions into a single FPGA.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces external memory dependencies for many buffering and caching tasks.
  • High I/O density: 840 I/Os and a 1932-ball FCBGA package support dense, high-pin-count designs and flexible board-level interfacing.
  • Industrial temperature rating: Specified −40°C to 100°C to address industrial use cases that require wide temperature operation.
  • Low-voltage core operation: Narrow core supply range (820 mV–880 mV) for predictable power design and voltage management.
  • Compliance: RoHS compliant to meet environmental regulatory requirements.

Why Choose 5SGSMD8N2F45I3LG?

The 5SGSMD8N2F45I3LG combines extensive logic resources, significant embedded memory, and a high I/O count in a single industrial-grade FCBGA package. This combination makes it well suited for designs that require on-chip capacity for complex algorithms, large data buffering, and numerous external interfaces while operating across a wide temperature range.

Its specification-driven feature set supports development teams and procurement seeking a scalable, high-capacity Stratix V GS FPGA with clear electrical and environmental parameters for system-level planning and long-term deployment.

Request a quote or submit a sales inquiry for part number 5SGSMD8N2F45I3LG to receive pricing, availability, and ordering information.

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