5SGSMD8N3F45C3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,049 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N3F45C3N – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD8N3F45C3N is a Stratix V GS field programmable gate array (FPGA) IC from Intel, offering large on-chip logic and memory resources in a high-pin-count FCBGA package. It is built to support complex, high-density programmable logic designs that require extensive I/O and embedded RAM.

Key architectural highlights include approximately 695,000 logic elements and roughly 51.2 Mbits of embedded memory, combined with 840 user I/Os and a compact 1932-ball FCBGA package for surface-mount applications.

Key Features

  • Logic Capacity  Approximately 695,000 logic elements (cells) to implement large, complex FPGA designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for large buffering, state storage, and data processing tasks.
  • I/O Resources  840 user I/Os to support wide parallel interfaces and extensive connectivity needs.
  • Power & Core Voltage  Core supply range of 820 mV to 880 mV for defined power planning and supply design.
  • Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device suited for high-density PCB layouts.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant.

Unique Advantages

  • High logic density: The large logic element count enables implementation of substantial custom logic and deep datapaths without external logic expansion.
  • Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs, simplifying system BOM.
  • Extensive I/O availability: 840 I/Os offer flexibility to connect multiple high-pin interfaces and peripherals directly to the FPGA fabric.
  • Compact, production-ready package: The 1932-ball FCBGA surface-mount package delivers high I/O density in a board-friendly form factor for complex PCB designs.
  • Predictable power envelope: The specified 820 mV–880 mV core supply range enables precise power-supply design and thermal budgeting.
  • Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.

Why Choose 5SGSMD8N3F45C3N?

The 5SGSMD8N3F45C3N is positioned for designs that demand substantial programmable logic, plentiful embedded RAM, and broad I/O capability in a single FCBGA package. Its combination of approximately 695,000 logic elements, around 51.2 Mbits of on-chip memory, and 840 I/Os makes it suitable for high-density FPGA applications where board space and integration matter.

As a Stratix V GS device from Intel, this part provides a defined operating voltage window and commercial temperature rating, enabling repeatable power and thermal planning for production designs while meeting RoHS environmental compliance requirements.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGSMD8N3F45C3N.

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