5SGSMD8N3F45C3N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,049 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8N3F45C3N – Stratix® V GS Field Programmable Gate Array (FPGA)
The 5SGSMD8N3F45C3N is a Stratix V GS field programmable gate array (FPGA) IC from Intel, offering large on-chip logic and memory resources in a high-pin-count FCBGA package. It is built to support complex, high-density programmable logic designs that require extensive I/O and embedded RAM.
Key architectural highlights include approximately 695,000 logic elements and roughly 51.2 Mbits of embedded memory, combined with 840 user I/Os and a compact 1932-ball FCBGA package for surface-mount applications.
Key Features
- Logic Capacity Approximately 695,000 logic elements (cells) to implement large, complex FPGA designs.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for large buffering, state storage, and data processing tasks.
- I/O Resources 840 user I/Os to support wide parallel interfaces and extensive connectivity needs.
- Power & Core Voltage Core supply range of 820 mV to 880 mV for defined power planning and supply design.
- Package & Mounting 1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device suited for high-density PCB layouts.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant.
Unique Advantages
- High logic density: The large logic element count enables implementation of substantial custom logic and deep datapaths without external logic expansion.
- Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs, simplifying system BOM.
- Extensive I/O availability: 840 I/Os offer flexibility to connect multiple high-pin interfaces and peripherals directly to the FPGA fabric.
- Compact, production-ready package: The 1932-ball FCBGA surface-mount package delivers high I/O density in a board-friendly form factor for complex PCB designs.
- Predictable power envelope: The specified 820 mV–880 mV core supply range enables precise power-supply design and thermal budgeting.
- Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
Why Choose 5SGSMD8N3F45C3N?
The 5SGSMD8N3F45C3N is positioned for designs that demand substantial programmable logic, plentiful embedded RAM, and broad I/O capability in a single FCBGA package. Its combination of approximately 695,000 logic elements, around 51.2 Mbits of on-chip memory, and 840 I/Os makes it suitable for high-density FPGA applications where board space and integration matter.
As a Stratix V GS device from Intel, this part provides a defined operating voltage window and commercial temperature rating, enabling repeatable power and thermal planning for production designs while meeting RoHS environmental compliance requirements.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGSMD8N3F45C3N.

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