5SGSMD8N3F45I4N

The 5SGSMD8N3F45I4N is a Stratix® V GS field-programmable gate array (FPGA) from Intel designed for designs that require large on-chip logic and memory resources. This device combines high logic capacity with a substantial embedded memory pool and a high I/O count in a 1932-ball FCBGA package, addressing demanding industrial-temperature applications.

Key attributes include 695,000 logic elements, approximately 51 Mbits of embedded memory, 840 I/Os, and an industrial operating temperature range, making the device suitable for complex, high-density FPGA designs.

Key Features

• Logic Capacity — 695,000 logic elements to support large, complex designs and implement extensive custom logic.
• Embedded Memory — Approximately 51 Mbits of on-chip RAM (51.2 Mbits) for data buffering, state storage, and algorithm implementation without excessive external memory.
• I/O Density — 840 I/Os providing extensive interface options for multi-channel designs and high pin-count system integration.
• Power and Core Supply — Core voltage supply specified between 820 mV and 880 mV to match platform power delivery requirements.
• Package and Mounting — 1932-ball BGA (FCBGA) package, supplier package 1932-FBGA, FC (45×45), designed for standard surface-mount PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Status — RoHS compliant.

Typical Applications

• High-density FPGA designs — Implement large-scale digital logic and state machines using the device’s 695,000 logic elements and abundant on-chip RAM.
• Systems with wide I/O requirements — Support complex multi-interface boards and parallel data paths with 840 available I/Os.
• Industrial equipment — Deploy in industrial-temperature environments where operation from −40 °C to 100 °C is required.

Unique Advantages

• Substantial on-chip resources: High logic element count and approximately 51 Mbits of embedded memory reduce dependence on external logic and RAM.
• High interface flexibility: 840 I/Os enable direct connectivity to numerous peripherals and high-pin-count system requirements.
• Designed for industrial use: Wide operating temperature range supports rugged applications and extended environmental tolerances.
• Compact, manufacturable package: 1932-ball FCBGA in a 45×45 supplier footprint for dense board-level integration and surface-mount assembly.
• Controlled core supply window: Specified 820–880 mV core voltage range simplifies power-supply planning for high-performance FPGA cores.
• Standards-aligned compliance: RoHS compliance supports regulatory and environmental requirements for modern electronics.

Why Choose 5SGSMD8N3F45I4N?

The 5SGSMD8N3F45I4N positions itself as a high-capacity Stratix V GS FPGA option for teams needing large logic and memory resources paired with a high I/O count and industrial temperature capability. Its combination of approximately 51 Mbits of embedded RAM, 695,000 logic elements, and 840 I/Os in a 1932-BBGA package supports dense, feature-rich FPGA implementations while operating within a defined core voltage window.

This device is appropriate for development and deployment scenarios that prioritize integration density, substantial on-chip resources, and industrial-grade temperature tolerance, backed by Intel’s Stratix V device family documentation and product support ecosystem.

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