5SGSMD8N2F45C3G

The 5SGSMD8N2F45C3G is an Intel Stratix® V GS field programmable gate array (FPGA) offered in a 1932-BBGA FCBGA package. It is a commercial-grade, surface-mount FPGA with a high logic and I/O density tailored for complex board-level designs.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/Os, this device targets high-density digital implementations that require significant on-chip resources while operating within a commercial temperature range.

Key Features

• Core Density  695,000 logic elements provide large-scale programmable fabric for complex logic and compute functions.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM to support data buffering, state storage, and embedded processing tasks.
• I/O Capacity  840 user I/Os to support extensive parallel interfaces, board-level connectivity, and multiple external peripherals.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting for standard PCB assembly flows.
• Power Envelope  Core voltage supply range specified at 820 mV to 880 mV to match low-voltage FPGA core power rails.
• Temperature Grade  Commercial operating temperature range from 0 °C to 85 °C, designed for commercial electronics applications.
• Manufacturer  Designed and supplied by Intel as part of the Stratix V GS family.

Typical Applications

• High-density FPGA designs  Systems that require large programmable logic resource pools and substantial embedded memory capacity.
• High I/O interface systems  Board-level applications needing hundreds of I/Os for parallel buses, expansion connectors, or multiple peripheral interfaces.
• Compact, surface-mount platforms  PCB designs that require a high-pin-count BGA package (1932-BBGA) and surface-mount assembly.
• Commercial temperature deployments  Products and prototypes intended to operate within 0 °C to 85 °C ambient conditions.

Unique Advantages

• High integration density: Large logic element count and substantial on-chip RAM reduce the need for external logic and memory components.
• Extensive I/O resources: 840 I/Os enable complex external interfacing and consolidation of multiple signals on a single device.
• Low-voltage core compatibility: Core supply specified between 820 mV and 880 mV to align with modern low-voltage FPGA power domains.
• Space-efficient packaging: 1932-BBGA package provides high pin count in a single solderable package for compact board layouts.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation for mainstream electronic product applications.

Why Choose 5SGSMD8N2F45C3G?

The 5SGSMD8N2F45C3G delivers a balance of high logic capacity, significant on-chip memory, and broad I/O in a single commercial-grade Stratix V GS FPGA. Its specification set makes it suitable for designers who need to consolidate complex logic, memory buffering, and substantial external connectivity onto one device while using a standard surface-mount BGA footprint.

As part of the Intel Stratix V family, this device is positioned for projects where dense programmable resources, high I/O count, and a 0 °C to 85 °C operating window are primary selection criteria, offering a scalable option for high-density board-level FPGA implementations.

If you would like pricing, availability, or to request a quote for 5SGSMD8N2F45C3G, submit a quote request or sales inquiry today.