5SGTMC7K3F40I3
| Part Description |
Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 335 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234750 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGTMC7K3F40I3 – Stratix® V GT FPGA, 600 I/Os, approximately 51.2 Mbits embedded memory, 622,000 logic elements, 1517-BBGA
The 5SGTMC7K3F40I3 is a Stratix® V GT field programmable gate array (FPGA) in a 1517-ball FCBGA package designed for industrial-grade embedded applications. It combines a large logic fabric, abundant embedded memory, and a rich set of DSP resources to address complex control, signal processing, and logic integration tasks.
With support for a wide operating temperature range and a low-voltage core supply, this device targets designs that require high-density logic, substantial on-chip memory, and flexible I/O capabilities within a surface-mount, industrial-grade package.
Key Features
- High-density logic — 622,000 logic elements provide substantial programmable fabric for complex state machines, custom accelerators, and large combinational/sequential logic implementations.
- Registers and timing resources — 938,880 registers, 16 global clocks and 92 regional clocks help organize large designs and support sophisticated clock domain management.
- Embedded memory — Approximately 51.2 Mbits of on-chip RAM supply local storage for buffers, FIFOs, and working memory to minimize external memory accesses.
- DSP and arithmetic — 256 hardened 18×18 multipliers and 256 single-precision floating-point multipliers/adders accelerate signal processing, filtering, and numeric workloads directly in silicon.
- I/O and interfacing — 600 GPIOs are available for general-purpose connectivity; datasheet notes up to 776 maximum user I/O pins and support for up to 150 LVDS channels for multi-lane signaling and parallel data interfaces.
- Clocking and PLLs — Up to 28 PLLs provide flexible clock generation and deskewing options for multi-domain and high-performance designs.
- Package and mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA surface-mount package suitable for compact PCB implementations.
- Industrial operating range — Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial deployments.
- Power — Core supply range defined at 820 mV to 880 mV to match system power-rail planning.
Typical Applications
- Industrial control and automation — Implement complex control logic, real-time processing, and I/O aggregation in temperature-challenging environments using the device’s industrial grade rating and extensive logic resources.
- Signal processing and instrumentation — Leverage the 256 multipliers and substantial on-chip RAM for filtering, FFTs, and other DSP tasks where local compute density reduces latency and external memory dependence.
- High-channel I/O systems — Use the large GPIO complement and LVDS channel support for multi-channel data acquisition, sensor hubs, and parallel interface aggregation.
- Prototyping and system integration — Consolidate functions into a single FPGA platform to shorten development cycles and reduce BOM by moving glue logic, protocol bridging, and custom accelerators into programmable fabric.
Unique Advantages
- Large programmable fabric: 622,000 logic elements enable integration of large custom logic blocks and complex state machines without external glue logic.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduce reliance on external memory for buffering and working storage, improving determinism and throughput.
- Dedicated DSP resources: 256 hardened multipliers and single-precision floating-point units accelerate compute-heavy functions while freeing logic elements for control and interfacing.
- Robust clocking: 16 global and 92 regional clocks along with 28 PLLs simplify clock domain partitioning and timing closure for multi-rate designs.
- Industrial-ready packaging and temperature range: Surface-mount 1517-BBGA package plus −40 °C to 100 °C rating supports deployment in industrial environments.
- Flexible I/O mix: Hundreds of GPIOs with support for LVDS channels offer adaptable connectivity for a wide variety of sensors, parallel interfaces, and board-level peripherals.
Why Choose 5SGTMC7K3F40I3?
The 5SGTMC7K3F40I3 positions itself as a high-density Stratix® V GT FPGA suited for industrial applications that require a balance of logic capacity, embedded memory, and DSP compute in a single surface-mount package. Its combination of hundreds of GPIOs, extensive multiplier resources, and significant on-chip RAM makes it appropriate for demanding signal processing, control, and I/O-intensive designs.
This device is a fit for engineering teams seeking a scalable, integrated programmable platform that supports complex algorithms and system consolidation while meeting industrial temperature and packaging requirements.
Request a quote or submit a request for pricing and availability to evaluate the 5SGTMC7K3F40I3 for your next design.

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