5SGTMC7K3F40I3

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 335 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234750Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits51200000

Overview of 5SGTMC7K3F40I3 – Stratix® V GT FPGA, 600 I/Os, approximately 51.2 Mbits embedded memory, 622,000 logic elements, 1517-BBGA

The 5SGTMC7K3F40I3 is a Stratix® V GT field programmable gate array (FPGA) in a 1517-ball FCBGA package designed for industrial-grade embedded applications. It combines a large logic fabric, abundant embedded memory, and a rich set of DSP resources to address complex control, signal processing, and logic integration tasks.

With support for a wide operating temperature range and a low-voltage core supply, this device targets designs that require high-density logic, substantial on-chip memory, and flexible I/O capabilities within a surface-mount, industrial-grade package.

Key Features

  • High-density logic — 622,000 logic elements provide substantial programmable fabric for complex state machines, custom accelerators, and large combinational/sequential logic implementations.
  • Registers and timing resources — 938,880 registers, 16 global clocks and 92 regional clocks help organize large designs and support sophisticated clock domain management.
  • Embedded memory — Approximately 51.2 Mbits of on-chip RAM supply local storage for buffers, FIFOs, and working memory to minimize external memory accesses.
  • DSP and arithmetic — 256 hardened 18×18 multipliers and 256 single-precision floating-point multipliers/adders accelerate signal processing, filtering, and numeric workloads directly in silicon.
  • I/O and interfacing — 600 GPIOs are available for general-purpose connectivity; datasheet notes up to 776 maximum user I/O pins and support for up to 150 LVDS channels for multi-lane signaling and parallel data interfaces.
  • Clocking and PLLs — Up to 28 PLLs provide flexible clock generation and deskewing options for multi-domain and high-performance designs.
  • Package and mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA surface-mount package suitable for compact PCB implementations.
  • Industrial operating range — Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial deployments.
  • Power — Core supply range defined at 820 mV to 880 mV to match system power-rail planning.

Typical Applications

  • Industrial control and automation — Implement complex control logic, real-time processing, and I/O aggregation in temperature-challenging environments using the device’s industrial grade rating and extensive logic resources.
  • Signal processing and instrumentation — Leverage the 256 multipliers and substantial on-chip RAM for filtering, FFTs, and other DSP tasks where local compute density reduces latency and external memory dependence.
  • High-channel I/O systems — Use the large GPIO complement and LVDS channel support for multi-channel data acquisition, sensor hubs, and parallel interface aggregation.
  • Prototyping and system integration — Consolidate functions into a single FPGA platform to shorten development cycles and reduce BOM by moving glue logic, protocol bridging, and custom accelerators into programmable fabric.

Unique Advantages

  • Large programmable fabric: 622,000 logic elements enable integration of large custom logic blocks and complex state machines without external glue logic.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduce reliance on external memory for buffering and working storage, improving determinism and throughput.
  • Dedicated DSP resources: 256 hardened multipliers and single-precision floating-point units accelerate compute-heavy functions while freeing logic elements for control and interfacing.
  • Robust clocking: 16 global and 92 regional clocks along with 28 PLLs simplify clock domain partitioning and timing closure for multi-rate designs.
  • Industrial-ready packaging and temperature range: Surface-mount 1517-BBGA package plus −40 °C to 100 °C rating supports deployment in industrial environments.
  • Flexible I/O mix: Hundreds of GPIOs with support for LVDS channels offer adaptable connectivity for a wide variety of sensors, parallel interfaces, and board-level peripherals.

Why Choose 5SGTMC7K3F40I3?

The 5SGTMC7K3F40I3 positions itself as a high-density Stratix® V GT FPGA suited for industrial applications that require a balance of logic capacity, embedded memory, and DSP compute in a single surface-mount package. Its combination of hundreds of GPIOs, extensive multiplier resources, and significant on-chip RAM makes it appropriate for demanding signal processing, control, and I/O-intensive designs.

This device is a fit for engineering teams seeking a scalable, integrated programmable platform that supports complex algorithms and system consolidation while meeting industrial temperature and packaging requirements.

Request a quote or submit a request for pricing and availability to evaluate the 5SGTMC7K3F40I3 for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up