5SGTMC7K3F40C2WN

The 5SGTMC7K3F40C2WN is a Stratix® V GT Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. This commercial-grade device provides very high logic density combined with substantial on-chip memory and a large I/O count for complex digital designs.

Designed for applications that require large programmable fabric, significant embedded RAM, and high pin count, the device targets designs where integration of logic, memory, and I/O in a single FPGA package reduces board-level complexity.

Key Features

• Core and Logic Capacity 622,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Logic Array Blocks 234,750 LABs/CLBs documented for fabric partitioning and resource planning.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and data-intensive functions without external memory.
• High I/O Count 600 user I/O pins to support dense connectivity and multiple peripheral interfaces.
• Package & Mounting 1517-BBGA (FCBGA) / supplier package 1517-FBGA (40×40); surface-mount mounting type for board-level integration.
• Power and Operating Range Core supply range from 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C (commercial grade).
• Compliance RoHS compliant, meeting common environmental restrictions for commercial electronics.
• Stratix V Family Characteristics Part of the Stratix V GT device family, with electrical and switching characteristics documented in the Stratix V device datasheet.

Typical Applications

• High-density digital processing Use the large logic capacity and embedded memory to implement complex datapath, signal processing, and algorithm acceleration within a single device.
• High-pin-count interfacing Leverage 600 I/O pins for designs that require multiple parallel interfaces, board-level bridging, or wide bus connectivity.
• Commercial embedded systems Deploy in commercial-temperature systems where a high-performance, surface-mount FPGA package and RoHS compliance are required.

Unique Advantages

• High integration density: Consolidate functions on-chip with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, reducing external components.
• Extensive I/O capability: 600 I/O pins enable flexible interfacing and reduce the need for external multiplexing or expanders.
• Compact, production-ready package: 1517-FBGA (40×40) surface-mount package provides a dense form factor suitable for space-constrained PCBs.
• Commercial temperature operation: Rated 0 °C to 85 °C for mainstream commercial deployments.
• Controlled core voltage range: Defined core supply of 870 mV to 930 mV supports predictable power design and supply planning.
• Regulatory readiness: RoHS compliance supports environmentally conscious product development and regulatory requirements.

Why Choose 5SGTMC7K3F40C2WN?

The 5SGTMC7K3F40C2WN combines very large programmable logic resources with substantial embedded memory and a high I/O count in a single commercial-grade FCBGA package. It is well suited to designers who need to consolidate complex digital functions, on-chip data buffering, and high-density interfacing while maintaining a compact board footprint.

As a member of the Stratix V GT family from Intel, the device aligns with documented electrical and switching characteristics for the family and provides a verifiable specification set for engineers planning high-capacity FPGA implementations.

If you would like pricing, availability, or a formal quote for the 5SGTMC7K3F40C2WN, request a quote or submit an inquiry to receive detailed purchasing information and lead-time estimates.