5SGTMC7K3F40C1

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 1,628 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234750Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits51200000

Overview of 5SGTMC7K3F40C1 – Stratix® V GT FPGA, 600 I/O, 622,000 Logic Elements, 1517-BBGA

The 5SGTMC7K3F40C1 is a Stratix® V GT field programmable gate array (FPGA) IC delivering high device density and on-chip memory for demanding programmable logic applications. It combines 622,000 logic elements and approximately 51.2 Mbits of embedded memory with extensive I/O capacity to support complex system integration in commercial-grade designs.

With a rich complement of hardened multipliers and floating-point resources, flexible clocking and power characteristics, and a compact 1517-BBGA FCBGA package, this device targets designers who need high-density programmable logic and compute resources in a single-device solution.

Key Features

  • Logic Capacity — 622,000 logic elements and 938,880 registers provide substantial fabric for large custom logic designs and control systems.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, state storage and data manipulation without external memory.
  • Hardened Math and DSP Resources — 256 hardened single-precision floating-point multipliers/adders and 256 18×18 multipliers for compute- and signal-processing workloads.
  • Clocking — 16 global clocks and 92 regional clocks along with 28 PLLs to support complex timing domains and high-performance synchronous designs.
  • I/O and GPIO — 600 GPIOs with support for up to 776 user I/O pins and up to 150 LVDS channels to interface with a wide range of peripherals and high-speed signaling.
  • Package and Mounting — 1517-BBGA, FCBGA package; supplier device package listed as 1517-FBGA (40×40), optimized for surface-mount assembly.
  • Power — Core voltage supply specified between 870 mV and 930 mV to match system power-rail planning.
  • Operating Range & Compliance — Commercial operating temperature 0 °C to 85 °C and RoHS-compliant.

Typical Applications

  • High-performance signal processing — Leverage the 256 floating-point and 18×18 multiplier resources for DSP algorithms, filtering and real-time compute tasks.
  • Compute acceleration — Use the large logic fabric and on-chip memory to implement custom accelerators and hardware offload engines.
  • Networking and communications — High I/O count and LVDS channel support enable interface aggregation, packet processing and high-speed link handling.
  • Complex system integration — Combine control logic, memory buffering and specialized math blocks to consolidate multiple functions into a single device.

Unique Advantages

  • High integration density: 622,000 logic elements and abundant registers reduce the need for multiple FPGAs, simplifying board design and BOM.
  • On-chip memory for latency-sensitive tasks: Approximately 51.2 Mbits of embedded RAM enables large buffers and state machines without external memory dependencies.
  • Dedicated compute resources: Hardened floating-point and multiplier blocks accelerate math-intensive functions while freeing general logic for control and glue logic.
  • Flexible clocking architecture: Multiple global and regional clocks plus 28 PLLs make it easier to manage multi-domain timing and high-speed interfaces.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS-compliant for mainstream commercial product deployments.

Why Choose 5SGTMC7K3F40C1?

The 5SGTMC7K3F40C1 positions itself as a high-density, highly integrated FPGA suited for designs that demand substantial logic resources, on-chip memory and dedicated compute blocks. Its combination of logic elements, embedded RAM and hardened multipliers supports both complex control logic and compute-heavy functions within a single package.

This device is well suited for commercial applications where consolidation of functions, deterministic on-chip processing and flexible I/O options improve system performance and reduce overall component count. Its package, power and clock resources enable scalable designs that can be deployed across a range of commercial systems.

Request a quote or submit a pricing inquiry to get detailed availability and lead-time information for the 5SGTMC7K3F40C1.

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