5SGXAF45NAD

IC FPGA 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 38797312 420000 1932-BBGA, FCBGA

Quantity 681 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeN/AOperating TemperatureN/A
Package / Case1932-BBGA, FCBGANumber of I/O840VoltageN/A
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits38797312

Overview of 5SGXAF45NAD – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 420,000 logic elements, ~38.8 Mbits RAM, 1932‑BBGA

The 5SGXAF45NAD is an Intel Stratix V GX family FPGA supplied in a 1932‑ball FCBGA package for surface‑mount assembly. It delivers large programmable logic capacity and on‑chip memory targeted at high‑density FPGA designs.

As a member of the Stratix V GX series, this device is positioned for system designs that require extensive logic resources, substantial embedded RAM, and a high I/O count. Series documentation also describes Stratix V GX transceiver speed grade options available across the family.

Key Features

  • Logic Capacity  Provides 420,000 logic elements for complex digital designs and high‑density implementation.
  • Embedded Memory  Approximately 38.8 Mbits of on‑chip RAM for large buffers, FIFOs, and local datastore requirements.
  • I/O Density  Up to 840 user I/Os to support wide parallel interfaces and extensive peripheral connectivity.
  • Package & Mounting  1932‑BBGA (supplier package listed as 1932‑FBGA, FC 45×45) in a surface‑mount form factor to support compact PCB integration.
  • Series Transceiver Options  Stratix V GX series documentation includes multiple transceiver speed grades across the family (series‑level characteristic).
  • Environmental Compliance  RoHS‑compliant device.

Typical Applications

  • High‑density digital processing  Use where large programmable logic and on‑chip RAM are needed for complex algorithms and custom datapaths.
  • System integration and prototyping  Suitable for consolidating multiple functions into a single FPGA fabric when significant logic and I/O are required.
  • Multi‑lane or wide interface designs  High I/O count supports designs that require many parallel or multi‑channel physical interfaces.

Unique Advantages

  • Extensive logic resources: 420,000 logic elements enable implementation of large, partitioned designs without immediate need for multi‑FPGA partitioning.
  • Large embedded RAM: Approximately 38.8 Mbits of on‑chip memory reduces dependence on external memory for many buffering and caching tasks.
  • High I/O capacity: 840 I/Os simplify board‑level routing for complex system interfaces and large connector footprints.
  • Dense BGA packaging: 1932‑ball FCBGA package supports high‑pin‑count designs in a compact footprint for PCB space efficiency.
  • RoHS compliant: Helps meet environmental requirements for lead‑free assembly processes.

Why Choose 5SGXAF45NAD?

The 5SGXAF45NAD combines a substantial logic fabric, generous embedded memory, and a high I/O count in a compact BGA package, making it a strong option for designs that demand dense programmable resources on a single device. As part of the Stratix V GX family, it aligns with series‑level capabilities documented for Stratix V devices.

This part is suited to engineering teams and procurement looking for a high‑capacity FPGA building block for complex systems, where on‑chip RAM, logic density, and I/O availability directly support integration and performance requirements. The device’s package and surface‑mount mounting type facilitate modern PCB assembly flows while maintaining compliance with RoHS requirements.

If you would like pricing, availability, or to request a quote for 5SGXAF45NAD, submit your request and our team will respond with the next steps.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up