5SGXEA3H1F35C2G

The 5SGXEA3H1F35C2G is a Stratix® V GX field programmable gate array (FPGA) in a 1152-FBGA (35×35) package. This commercial-grade device delivers a high logic element count, substantial on-chip RAM, and a large I/O count in a surface-mount FCBGA package.

Key on-chip resources and package-level characteristics—340,000 logic elements, approximately 19.456 Mbits of embedded memory, 432 I/Os, a 870–930 mV core supply range, and a commercial operating temperature range of 0 °C to 85 °C—make this device suitable where dense programmable logic and significant memory and I/O resources are required.

Key Features

• Core / Logic 340,000 logic elements (cells) for large-scale programmable logic integration.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support packet buffers, FIFOs, and other memory-intensive logic functions.
• I/O Capacity 432 general-purpose I/O pins, enabling broad interfacing options with peripherals and system-level signals.
• Package & Mounting 1152-FBGA (35×35) FCBGA package in a surface-mount form factor for compact board-level integration.
• Power Core voltage supply range of 870 mV to 930 mV to match system power rails and power-delivery designs.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High logic density: 340,000 logic elements allow consolidation of complex digital functions into a single device, reducing board count and PCB area.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Extensive I/O: 432 I/Os provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front-end connectivity.
• Compact FCBGA package: 1152-FBGA (35×35) supports high-pin-count integration in a compact footprint for dense system designs.
• Commercial temperature specification: Rated 0 °C to 85 °C for applications and environments that operate within standard commercial temperature ranges.
• RoHS compliant: Meets environmental requirements for lead-free manufacturing and product compliance workflows.

Why Choose 5SGXEA3H1F35C2G?

The 5SGXEA3H1F35C2G combines high logic capacity, substantial embedded memory, and abundant I/O in a commercially graded Stratix V GX FPGA package. Its electrical and package characteristics—documented core voltage range, commercial temperature rating, and surface-mount FCBGA packaging—support system designs that need dense programmable logic, on-chip memory, and significant pin count in a single device.

This device suits designers and procurement teams seeking a high-density FPGA solution with clear, verifiable specifications for logic resources, memory, I/O capacity, package, power envelope, and commercial operating range.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEA3H1F35C2G for your next design.