5SGXEA3H1F35C2LN

The 5SGXEA3H1F35C2LN is a Stratix® V GX series Field Programmable Gate Array (FPGA) IC offered in a commercial-grade package. It provides a high logic capacity FPGA fabric combined with substantial on-chip memory and a large I/O count, packaged in a 1152-ball BGA (FCBGA) for dense system integration.

Designed for applications that require significant programmable logic, embedded RAM, and extensive I/O, the device is specified with a core supply range of 820 mV to 880 mV and an operating temperature range of 0°C to 85°C. The device datasheet covers the electrical and switching characteristics for Stratix V devices, including I/O timing and transceiver information.

Key Features

• High logic capacity — Approximately 340,000 logic elements to implement large-scale programmable logic and complex algorithms.
• Embedded memory — Approximately 19.46 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
• Extensive I/O — 432 I/O pins for broad interfacing to peripherals, memory, and custom board-level interconnects.
• Core voltage — Narrow core supply range of 820 mV to 880 mV to match platform power-rail requirements.
• Commercial temperature grade — Rated for 0°C to 85°C operation for standard commercial deployments.
• Package and mounting — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), surface-mount mounting type for compact, high-density board designs.
• RoHS compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High-density programmable logic — Use where large logic capacity is required to implement complex state machines, data-paths, or pipeline architectures.
• Memory-intensive functions — On-chip RAM supports buffering, packet queues, and other embedded-memory workloads without immediate external memory dependence.
• Multi-I/O interfacing — The 432 I/O pins enable broad connectivity for systems requiring numerous external interfaces or parallel buses.

Unique Advantages

• Substantial logic resources — Approximately 340,000 logic elements provide headroom for large designs and future feature expansion.
• Significant on-chip RAM — Approximately 19.46 Mbits of embedded memory reduces reliance on external memory for many use cases.
• High I/O density — 432 I/Os simplify board-level routing and support multiple peripheral connections without additional multiplexing hardware.
• Compact, high-pin-count package — 1152-BBGA (35×35) packaging enables dense signal routing and compact PCB layouts for space-constrained systems.
• Commercial operating range — Specified 0°C to 85°C operation aligns with standard commercial product requirements.
• RoHS compliance — Environmentally compliant for markets and designs that require RoHS status.

Why Choose 5SGXEA3H1F35C2LN?

The 5SGXEA3H1F35C2LN positions itself as a high-capacity Stratix V GX FPGA for designs that demand large programmable fabric, substantial embedded memory, and a broad set of I/O resources. Its 1152-ball BGA package and surface-mount mounting support compact, high-density board implementations while the specified core voltage range and commercial temperature grade provide clear electrical and environmental boundaries for system design.

This device is appropriate for engineering teams and procurement looking for a verified Stratix V GX series part with explicit on-chip resources and package characteristics documented in the device datasheet. The combination of logic elements, embedded RAM, and I/O count offers scalability for feature-rich FPGA designs within commercial temperature operating conditions.

Request a quote or submit an inquiry today to discuss availability, pricing, and how the 5SGXEA3H1F35C2LN can fit your next FPGA design.