5SGXEA3H1F35I2N

The 5SGXEA3H1F35I2N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel. It provides a high-density programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of on‑chip RAM, packaged in a 1152‑BBGA FCBGA (35×35) surface‑mount package.

Designed for industrial‑grade applications, this device combines large logic capacity and substantial embedded memory with a wide operating temperature range and flexible I/O count, making it suitable for demanding system designs that require high integration and scalability.

Key Features

• Logic Capacity — 340,000 logic elements and 128,300 logic array blocks, enabling implementation of large, complex designs and multi‑function systems on a single device.
• Embedded Memory — Approximately 19.456 Mbits of total on‑chip RAM to support data buffering, FIFOs, and memory‑intensive logic functions.
• I/O Resources — 432 user I/Os to support wide parallel interfaces, extensive peripheral connectivity, and multi‑lane systems integration.
• Industrial Grade and Temperature Range — Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
• Core Voltage Supply — Core supply specified from 870 mV to 930 mV for precise power domain planning and system power budgeting.
• Package & Mounting — 1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35) with surface‑mount construction for compact board layouts.
• Regulatory Compliance — RoHS compliant, supporting environmental and procurement requirements.

Typical Applications

• Industrial Control and Automation — Large logic capacity and industrial temperature grading allow implementation of complex control algorithms, communication interfaces, and real‑time signal handling for factory and process automation.
• High‑Performance Data Processing — Substantial embedded RAM and a high logic element count accommodate data buffering, pipelined processing, and custom compute functions for DSP and data‑plane tasks.
• Communications and I/O‑Intensive Systems — 432 I/Os enable wide parallel interfaces and dense peripheral connectivity for networking equipment, protocol converters, and multi‑lane front‑end systems.

Unique Advantages

• High Integration Density: 340,000 logic elements and extensive embedded RAM reduce system BOM by consolidating multiple functions into a single FPGA.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, making the device suitable for extended deployments in harsh or temperature‑variable environments.
• Flexible I/O Count: 432 I/Os provide design flexibility for interfacing to sensors, processors, memory, and custom peripherals without external multiplexing.
• Compact Board Footprint: 1152‑BBGA (35×35) FCBGA package enables a high‑pin‑count solution in a compact surface‑mount form factor for dense PCB layouts.
• Controlled Core Power Domain: Defined core supply range (870 mV–930 mV) supports precise power sequencing and efficient power‑supply design.
• RoHS Compliance: Meets lead‑free and environmental procurement requirements for modern product manufacturing.

Why Choose 5SGXEA3H1F35I2N?

The 5SGXEA3H1F35I2N sits at the intersection of high logic density, substantial on‑chip memory, and broad I/O capability—packaged for industrial deployment. Its combination of 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 432 I/Os makes it a practical choice for designers consolidating complex signal processing, control, and interfacing functions onto a single FPGA.

Engineers and procurement teams seeking a robust, high‑capacity FPGA for industrial and demanding embedded applications will find this Stratix V GX device provides the scalability and board‑level integration needed to reduce component count and simplify system design while supporting extended temperature operation and RoHS compliance.

Request a quote or submit your product inquiry to evaluate 5SGXEA3H1F35I2N for your next design and get detailed pricing and availability information.