5SGXEA3H1F35I2G

The 5SGXEA3H1F35I2G is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in an industrial temperature grade. It integrates a high count of programmable logic, substantial embedded RAM, and a large I/O complement in a compact FCBGA package.

This device targets designs that require high logic capacity, significant on-chip memory, and extensive I/O while maintaining industrial operating range and RoHS compliance. Core supply operation is specified between 870 mV and 930 mV, and the device supports surface-mount assembly in a 1152-FBGA (35×35) package.

Key Features

• High Logic Capacity  Approximately 340,000 logic elements to implement complex algorithms and large programmable designs.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic without immediate reliance on external RAM.
• Extensive I/O  432 general-purpose I/O pins to connect multiple peripherals, interfaces, and system domains directly to the FPGA fabric.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Core Voltage Range  Core supply specified from 870 mV to 930 mV for defined power and performance operation.
• Package & Mounting  1152-FBGA (35×35) FCBGA, surface-mount package for high-density PCB implementations.
• RoHS Compliant  Manufactured to meet RoHS environmental standards.
• Series-Level Transceiver Capability (datasheet)  Stratix V GX series documentation lists GX transceiver speed grades (series-level) with channel capabilities up to 14.1 Gbps.

Typical Applications

• High-density programmable logic  Consolidate complex control and signal-processing functions using the device’s ~340,000 logic elements.
• Memory-intensive processing  Leverage approximately 19.5 Mbits of embedded RAM for buffering, queues, and state machines without immediate external memory.
• Multi-interface systems  Support systems requiring a large number of interfaces and peripherals with 432 I/O pins for direct connectivity.
• Industrial equipment  Deploy in industrial applications that require operation across –40 °C to 100 °C while maintaining RoHS compliance.

Unique Advantages

• High logic integration: Consolidate functions into a single device with ~340,000 logic elements to reduce board-level component count.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces dependence on external memory and simplifies system design.
• Large I/O capacity: 432 I/O pins enable broad peripheral and subsystem connectivity without additional bridging devices.
• Industrial-ready thermal window: –40 °C to 100 °C rating supports robust operation in industrial environments.
• Compact high-density package: 1152-FBGA (35×35) FCBGA surface-mount package enables dense PCB implementations while maintaining signal routing options.
• Defined core voltage: 870 mV–930 mV core supply specification enables predictable power planning and board-level power delivery design.

Why Choose 5SGXEA3H1F35I2G?

The 5SGXEA3H1F35I2G positions itself as a high-capacity, industrial-grade Stratix V GX FPGA that combines a large programmable fabric, significant on-chip RAM, and extensive I/O in a compact FCBGA package. Its electrical and thermal specs are suited to designs that prioritize integration and reliability in industrial environments.

This device is appropriate for engineering teams designing systems that require consolidated logic, ample embedded memory, and high I/O density while adhering to RoHS requirements and operating across a wide temperature range. The defined core voltage and package details simplify power and PCB planning for production implementations.

Request a quote or submit a procurement inquiry through your preferred distributor or purchasing portal to evaluate availability and lead times for 5SGXEA3H1F35I2G.