5SGXEA3H2F35C1G

The 5SGXEA3H2F35C1G is a Stratix® V GX field-programmable gate array from Intel designed for high-density programmable logic applications. The device combines 340,000 logic elements, approximately 19.5 Mbits of on-chip RAM, and 432 user I/Os in a 1152‑ball FCBGA surface-mount package, making it suited to complex system integration and compute‑intensive designs.

This part is supplied in a commercial grade (0 °C to 85 °C) and operates with a core supply in the 870 mV to 930 mV range. It is RoHS compliant.

Key Features

• Core Logic 340,000 logic elements provide a large FPGA fabric for implementing complex state machines, datapaths, and custom acceleration logic.
• Embedded Memory Approximately 19.5 Mbits of on-chip RAM for buffering, FIFOs, and local data storage without immediate external memory dependence.
• I/O and Packaging 432 I/O pins in a 1152‑BBGA (supplier package: 1152‑FBGA 35×35) surface-mount package enable high-pin-count connectivity and dense board integration.
• Power Specified core voltage range of 870 mV to 930 mV for system power planning and regulator selection.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard embedded and enterprise applications.
• Regulatory RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density logic and compute: Implement complex datapaths, packet processing, or custom accelerators using the large logic element count and on-chip memory.
• System interfacing and I/O aggregation: Support multiple parallel buses, controllers, and peripherals with 432 user I/Os.
• Compact, board-level designs: The 1152‑ball FCBGA surface-mount package enables dense PCB layouts where board real estate is constrained.
• High-bandwidth serial systems: As a Stratix V GX family device, it supports the family’s transceiver capabilities described in the device documentation for high-speed serial connectivity.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for multi-FPGA partitioning and lower system BOM complexity.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM enables local buffering and reduces external memory traffic.
• Large I/O surface: 432 I/Os simplify integration of peripherals, memory interfaces, and parallel data paths without additional interface logic.
• Compact package format: 1152‑BBGA (35×35) FCBGA brings a high ball-count solution into a compact board footprint for space-constrained designs.
• Commercial-grade stability: Defined operating range (0 °C to 85 °C) and a specified core voltage window support predictable system behavior in commercial environments.
• RoHS compliance: Aligns with common manufacturing and environmental requirements.

Why Choose 5SGXEA3H2F35C1G?

The 5SGXEA3H2F35C1G delivers a balance of high logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package—well suited for complex embedded systems, high-density control applications, and board‑level integration where consolidation of functions onto a single FPGA matters. Backed by Intel’s Stratix V family documentation, this device is positioned for designers who need a programmable platform with clear electrical and thermal specifications for commercial-grade deployments.

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