5SGXEA3H2F35C2LG

The 5SGXEA3H2F35C2LG is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in a 1152‑ball fine‑pitch BGA (35 × 35 mm) package for surface‑mount assembly. It provides high logic density and extensive I/O in a commercially graded device designed for complex digital designs.

This device targets designs that require a large number of logic resources, substantial embedded memory, and a high pin count for system integration. The Stratix V family datasheet further documents high‑speed transceiver capabilities available in GX devices within the series.

Key Features

• Logic Density 340,000 logic elements provide a substantial fabric for complex digital functions and custom accelerators.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM to support buffering, packet processing, and state storage.
• I/O Count 432 user I/O pins enable broad connectivity to peripherals, memory interfaces, and board‑level interconnect.
• Package & Mounting 1152‑BBGA (FCBGA) 35×35 mm supplier device package designed for surface mount assembly in dense PCB layouts.
• Power Supply Core voltage operating range 820 mV to 880 mV, suitable for the device's specified operating conditions.
• Operating Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Series Transceiver Capability (Series Data) Stratix V GX devices in the series include high‑speed transceivers; series documentation lists GX channel rates up to 14.1 Gbps for applicable speed grades.
• Environmental Compliance RoHS‑compliant material status for regulatory conformity in many commercial electronics applications.

Typical Applications

• High‑density digital processing — Use the large logic element count and embedded RAM for compute‑intensive FPGA algorithms and custom datapath implementations.
• Network and communications systems — High I/O count and Stratix V GX series transceiver capability support board‑level networking and protocol handling.
• Prototyping and system integration — Dense logic and extensive I/O make the device suitable for developing and integrating complex digital subsystems on production PCBs.

Unique Advantages

• High logic capacity: 340,000 logic elements enable implementation of large, multi‑function designs without immediate migration to multiple devices.
• Substantial on‑chip memory: Approximately 19.456 Mbits of RAM reduces dependence on external memory for many buffering and stateful functions.
• Generous I/O: 432 I/O pins provide flexibility for parallel interfaces, high‑pin count memory buses, and mixed I/O signaling.
• Compact BGA package: 1152‑BBGA (35×35 mm) balances high pin count with a compact board footprint for high‑density PCBs.
• Commercial temperature rating: Operates across 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets RoHS requirements for lead‑free manufacturing and supply‑chain compliance.

Why Choose 5SGXEA3H2F35C2LG?

The 5SGXEA3H2F35C2LG combines very high logic density, meaningful on‑chip RAM, and a high I/O count in a single commercial‑grade Stratix V GX package. It is well suited for teams developing complex digital systems that require substantial internal resources and flexible board‑level connectivity while maintaining a compact BGA footprint.

As part of the Stratix V GX family, the device is positioned for designs that need large FPGA fabrics and series‑documented high‑speed transceiver options. Choose this part when you require a scalable, high‑density FPGA solution for advanced commercial applications.

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