5SGXEA3H2F35C2LN

The 5SGXEA3H2F35C2LN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152-BBGA (FCBGA) package. It provides a large programmable fabric and on-chip RAM suited to designs that require substantial logic capacity, embedded memory, and extensive I/O.

Device-level specifications include approximately 340,000 logic elements, roughly 19.456 Mbits of embedded memory, 432 I/O pins, and support for Stratix V GX transceiver speed grades documented in the series datasheet. This part is supplied as a commercial-grade device with a defined operating voltage range and temperature range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale HDL designs and complex digital functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Density  432 general-purpose I/O pins to support wide external interfaces and parallel connections.
• Transceiver Support (Series-Level)  Stratix V GX series devices include transceiver speed grades documented up to 14.1 Gbps depending on speed grade, as described in the device family datasheet.
• Power and Core Voltage  Core supply range specified from 820 mV to 880 mV for device operation.
• Package and Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount device for standard PCB assembly processes.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards  RoHS compliant.

Typical Applications

• High-density digital systems  Large logic element count and abundant embedded memory enable complex state machines, datapaths, and custom accelerators.
• High-speed serial interfaces  Stratix V GX transceiver speed grades documented in the family datasheet support implementation of high-speed serial links where applicable.
• Multi‑I/O system integration  432 I/O pins facilitate board-level integration with parallel busses, multiple peripherals, and wide external interfaces.
• Embedded processing and buffering  Significant on-chip RAM supports local buffering, packet queues, and on-FPGA storage for streaming and real-time tasks.

Unique Advantages

• High programmable density: Large logic element count provides room for complex designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• Abundant I/O: 432 I/O pins simplify connectivity for multi-channel and multi-peripheral systems, reducing the need for external multiplexing.
• Commercial temperature qualification: Rated for 0 °C to 85 °C to match typical commercial electronics environments.
• Low-voltage core operation: Narrow core supply range (820 mV–880 mV) for predictable power domain design and supply planning.
• RoHS compliance: Built to meet environmental requirements for lead-free assemblies.

Why Choose 5SGXEA3H2F35C2LN?

The 5SGXEA3H2F35C2LN delivers a substantial combination of programmable logic, embedded memory, and I/O capacity in a compact 1152-BBGA package for commercial-temperature systems. It is well suited to designs that require on-chip resources for complex logic, buffering, and multiple interfaces while preserving board area through a high-density package.

Choose this Stratix V GX device when your design requires a large programmable fabric, significant embedded RAM, and many I/Os, with the documented Stratix V series transceiver capabilities available depending on selected speed grade. The device offers a clear specification baseline (power, temperature, package, and RoHS status) to support procurement and system integration decisions.

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