5SGXEA3H2F35C3N

The 5SGXEA3H2F35C3N is an Intel Stratix V GX field-programmable gate array supplied in a 1152-BBGA (1152-FBGA 35×35) surface-mount package. It provides a high-capacity programmable fabric with substantial on-chip memory and a large I/O complement for complex digital designs.

As a member of the Stratix V GX family (series datasheet), the device supports Stratix V-series capabilities including high-speed transceiver speed grades, making it suitable for designs that require dense logic, significant embedded memory, and extensive I/O resources within a commercial temperature range.

Key Features

• Core logic capacity — 340,000 logic elements (cells) to implement large-scale digital designs and parallel processing architectures.
• Embedded memory — Approximately 19.46 Mbits of on-chip RAM for large buffers, FIFOs, and local storage.
• I/O resources — 432 I/O pins to support wide interfaces and multiple high-pin-count connections.
• Transceiver family support — Part of the Stratix V GX series; series datasheet lists GX transceiver speed grade options (series-level capability up to 14.1 Gbps).
• Package and mounting — 1152-BBGA, FCBGA package; supplier device package 1152-FBGA (35×35); surface-mount for standard PCB assembly processes.
• Power supply — Core operating voltage range 820 mV to 880 mV for integration with regulated power rails.
• Temperature and grade — Commercial grade; specified operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-speed data communications — Leverages the Stratix V GX family’s transceiver capabilities and 432 I/Os to implement multi-gigabit links and dense PHY interfaces.
• Network and packet processing — Large logic capacity and abundant embedded RAM enable packet buffering, classification, and custom network acceleration functions.
• Compute acceleration — Implements custom hardware accelerators and parallel processing pipelines using the FPGA’s 340,000 logic elements and on-chip memory.
• Prototyping and system integration — High I/O count and a standard FCBGA package make the device suitable for complex system prototypes and board-level integration.

Unique Advantages

• Highly parallel logic capacity: 340,000 logic elements provide headroom for large RTL designs and parallel architectures.
• Generous embedded memory: Approximately 19.46 Mbits of RAM reduces dependence on external memory for mid-size buffering and state storage.
• Extensive I/O connectivity: 432 I/O pins support multiple interfaces and high pin-count peripherals without additional multiplexing hardware.
• Series-level high-speed transceivers: As part of the Stratix V GX family, the device benefits from Stratix V transceiver options documented in the series datasheet.
• Compact, industry-standard package: 1152-BBGA (1152-FBGA 35×35) surface-mount package enables dense board layouts while preserving signal routing options.
• Commercial-grade reliability: Specified for 0 °C to 85 °C operation with RoHS compliance for standard commercial product environments.

Why Choose 5SGXEA3H2F35C3N?

The 5SGXEA3H2F35C3N positions itself as a high-capacity, commercially graded Stratix V GX FPGA suitable for demanding digital designs that require extensive logic, on-chip memory, and large I/O resources. Its package and power characteristics support integration into complex PCB designs while the series-level transceiver capabilities provide options for high-speed serial connectivity.

This device is appropriate for development teams and system designers building network equipment, compute accelerators, and high-throughput data-processing systems who need a verified FPGA platform within a commercial temperature range and RoHS-compliant supply chain.

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