5SGXEA3H2F35C3WN

The 5SGXEA3H2F35C3WN is a Stratix V GX field programmable gate array (FPGA) device providing 340,000 logic elements and 432 user I/Os in a 1152-BBGA (FCBGA) package. This commercial‑grade device offers a large on‑chip memory footprint and a compact surface‑mount package for high‑density, high‑I/O designs.

Designed as part of the Stratix V GX family, the device is specified with a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C, making it suitable for a range of commercial electronic systems that require substantial programmable logic and memory resources.

Key Features

• Core Logic  340,000 logic elements for complex programmable logic and large-scale integration.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, caching, and state storage.
• I/O Capacity  432 user I/Os to interface with multiple peripherals, buses, and parallel interfaces.
• Package & Mounting  1152‑BBGA (FCBGA) supplier device package listed as 1152‑FBGA (35 × 35); surface‑mount mounting type for board‑level integration.
• Power  Core voltage supply specified from 820 mV to 880 mV for device operation.
• Temperature & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS‑compliant material designation.
• Stratix V GX Series-Level Transceiver Support  As part of the Stratix V GX family, series documentation covers high‑speed transceiver capabilities and I/O timing specifications (series-level device documentation provides detailed transceiver speed grades and timing characteristics).

Typical Applications

• High‑density programmable logic  Use where a large number of logic elements and substantial on‑chip memory (≈19.456 Mbits) are required for complex logic and stateful functions.
• Multi‑I/O systems  Suitable for designs needing hundreds of user I/Os (432) to connect multiple peripherals, external memories, or parallel interfaces.
• Board‑level, surface‑mount FPGA integration  Ideal for compact, surface‑mount implementations that require a high‑pin‑count BGA package (1152‑BBGA / 35 × 35 supplier package).

Unique Advantages

• Large logic capacity: 340,000 logic elements provide the resource headroom to implement complex state machines, datapath processing, and large combinational logic blocks without partitioning across multiple devices.
• Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces the need for external memory in many buffering and caching use cases, simplifying board design.
• High I/O count: 432 user I/Os enable dense interfacing options and flexible connectivity for multi‑channel and multi‑bus systems.
• Compact BGA packaging: 1152‑BBGA (35 × 35 supplier package) balances pin count and board area for high‑pin‑count applications in a surface‑mount form factor.
• Commercial temperature operation: Rated for 0 °C to 85 °C to match a wide range of commercial electronic product requirements.
• RoHS compliant: Meets RoHS environmental requirement for material compliance.

Why Choose 5SGXEA3H2F35C3WN?

The 5SGXEA3H2F35C3WN brings together a large logic fabric, significant on‑chip RAM, and an extensive I/O complement in a single commercial‑grade Stratix V GX device. Its core voltage range and documented series‑level transceiver and I/O timing characteristics support demanding digital designs that require deterministic logic resources and flexible external interfacing.

This device is well suited for engineering teams and system designers who need a high‑resource FPGA in a compact surface‑mount BGA package, backed by Stratix V series documentation and design support materials for integration and performance characterization.

Request a quote or submit a pricing inquiry for 5SGXEA3H2F35C3WN to begin specifying this Stratix V GX FPGA into your next design. Include part number and required quantities for an expedited response.