5SGXEA3H2F35I2G

The 5SGXEA3H2F35I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152-pin FBGA (35×35) FCBGA package for surface-mount applications. This industrial-grade device combines a high logic-element count with substantial on-chip memory and a broad I/O complement to address complex, high-density designs.

Key hardware specifications include 340,000 logic elements, approximately 19.5 Mbits of embedded memory, 432 I/Os, an operating voltage range of 870 mV to 930 mV, and an industrial operating temperature range of −40 °C to 100 °C. The product is RoHS compliant.

Key Features

• Core & Logic 340,000 logic elements for implementing large, highly-parallel digital designs.
• Embedded Memory Approximately 19.5 Mbits of on-chip RAM to support large buffering, state storage, and local data processing.
• I/O Capacity 432 general-purpose I/Os to support dense external interfacing and multi-channel connectivity.
• Transceiver Capabilities (family-level) The Stratix V GX family includes documented transceiver speed grades up to 14.1 Gbps per channel, as detailed in the Stratix V device datasheet.
• Power and Voltage Core supply range from 870 mV to 930 mV to match system power-architecture requirements.
• Package & Mounting 1152-FBGA (35×35) FCBGA package, surface-mount mounting for high-density board designs.
• Operating Conditions & Grade Industrial temperature grade with a specified operating range of −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• High-density networking and packet processing — Leverage the large logic capacity and on-chip RAM for complex packet engines, flow processing, and protocol offload.
• Data center and telecom infrastructure — High I/O count and family transceiver capability support demanding I/O and high-speed link requirements.
• Test, measurement, and imaging systems — Large logic and memory resources enable real-time data aggregation and preprocessing.
• Industrial automation and control — Industrial-grade temperature range and extensive I/O make the device suitable for robust control and monitoring applications.

Unique Advantages

• High logic density: 340,000 logic elements provide the headroom for complex, parallel architectures and custom accelerators.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces external memory dependency and lowers system latency for buffering and local processing.
• Extensive I/O routing: 432 I/Os facilitate integration with multiple peripherals, sensors, and external interfaces without extensive external bridging.
• Industrial operating range: Specified −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact, surface-mount package: 1152-FBGA (35×35) FCBGA supports high-density PCB designs and automated assembly processes.
• Standards-aware family-level transceivers: Stratix V GX family transceiver grades are documented up to 14.1 Gbps per channel for designs that require high-speed serial connectivity.

Why Choose 5SGXEA3H2F35I2G?

The 5SGXEA3H2F35I2G positions itself for designs that demand a combination of high logic capacity, significant embedded memory, and a broad I/O footprint within an industrial-grade FPGA. Its FCBGA packaging and surface-mount form factor suit compact, high-density PCBs while the specified voltage and temperature ranges support robust system designs.

This device is appropriate for engineering teams building complex networking, telecom, industrial control, or instrumentation systems that require on-chip resources to minimize external components and optimize latency. The Stratix V GX family documentation provides transceiver-grade options for architectures needing high-speed serial links.

Request a quote or submit a product inquiry to evaluate 5SGXEA3H2F35I2G for your next design.