5SGXEA3H2F35I2L

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 1,205 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3H2F35I2L – Stratix® V GX FPGA, 340,000 logic elements, 432 I/Os, 1152-BBGA

The 5SGXEA3H2F35I2L is an Intel Stratix V GX family Field Programmable Gate Array (FPGA) supplied in a 1152-ball FCBGA package. This industrial-grade device delivers a high logic capacity and substantial on-chip memory for demanding embedded processing, high-speed communications, and data‑centric applications.

As a member of the Stratix V GX series, the device benefits from the family’s transceiver-capable architecture and is specified for industrial temperature operation, making it suitable for robust system designs that require large programmable logic resources and dense I/O.

Key Features

  • High Logic Density  340,000 logic elements provide extensive capacity for complex digital designs and large-scale RTL implementations.
  • Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, packet processing, and memory-intensive logic functions.
  • I/O Resources  432 user I/Os enable dense external connectivity for multi-channel interfaces and system expansion.
  • Family Transceiver Capability  Part of the Stratix V GX family, which includes transceiver speed grades up to 14.1 Gbps (family-level specification).
  • Package & Mounting  1152-ball FCBGA (35 × 35 mm) surface-mount package for compact, high-density board integration.
  • Power Supply  Core supply specified at 820 mV to 880 mV to match system power-rail planning and power-sequencing requirements.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for reliable performance across a wide thermal range.
  • RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

  • High‑speed Networking & Communications  Large logic capacity and the Stratix V GX transceiver-capable architecture suit packet processing, switching, and protocol offload functions.
  • Data Center & Accelerator Boards  Significant embedded memory and I/O density support buffering, custom compute blocks, and high-bandwidth host interfaces.
  • Industrial Control & Automation  Industrial temperature rating and robust I/O count enable deterministic control, complex motor drives, and multi-sensor aggregation.

Unique Advantages

  • Substantial Programmable Capacity: 340,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Large On‑Chip Memory: Approximately 19.46 Mbits of embedded RAM supports local buffering and high-throughput datapaths without immediate external memory dependence.
  • Dense External Connectivity: 432 I/Os provide flexibility for multi-lane interfaces, parallel buses, and extensive peripheral routing.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
  • Compact High‑Pin‑Count Package: 1152-ball FCBGA (35×35 mm) delivers high signal density in a board-friendly footprint for space-constrained designs.
  • Standards‑aware Manufacturing: RoHS compliance supports modern assembly and regulatory requirements.

Why Choose 5SGXEA3H2F35I2L?

The 5SGXEA3H2F35I2L positions itself as a high-capacity, industrial-grade FPGA option within the Stratix V GX family, combining hundreds of thousands of logic elements with multi-megabit embedded memory and a large I/O complement. Its package density and specified core voltage range enable integration into complex, high-performance systems where programmable logic and on-chip resources reduce external component count and simplify board design.

Choose this device when your design requires substantial programmable fabric, significant embedded memory, and robust thermal performance—particularly for networking, data-center acceleration, and industrial control applications that benefit from the Stratix V GX family capabilities.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA3H2F35I2L and to discuss how it can fit into your next design.

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