5SGXEA3H2F35I2LG

The 5SGXEA3H2F35I2LG is an Intel Stratix V GX family FPGA supplied in a 1152‑BBGA (35×35) FCBGA package. It delivers high-density programmable logic with approximately 340,000 logic elements, roughly 19.456 Mbits of embedded memory, and up to 432 user I/Os in a surface-mount BGA footprint.

Designed for industrial-grade applications, this device is rated for operation from −40 °C to 100 °C and supports a core supply range of 0.82–0.88 V. As a member of the Stratix V GX family, the device is part of a platform that offers multiple transceiver and core speed grade options (see datasheet for family-level details).

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale, high-density designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, packet processing, and state storage.
• I/O Density  Up to 432 user I/Os to support complex board-level interfaces and multiple peripheral connections.
• Package and Mounting  1152‑BBGA FCBGA (35×35) surface-mount package for compact, board-level integration.
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Core Voltage  Operating core supply 0.82–0.88 V for device power planning and supply design.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High‑density compute and acceleration  Large logic capacity and substantial embedded RAM make the device suitable for hardware acceleration and compute offload tasks.
• Telecommunications and networking  High I/O count and Stratix V GX family transceiver options (family-level) support packet processing, switching, and protocol handling in network systems.
• Industrial control and automation  Industrial temperature rating and robust packaging accommodate real‑world factory and process-control environments.
• Signal processing and test equipment  On-chip memory and dense logic enable implementation of real-time DSP pipelines and measurement logic.

Unique Advantages

• High logic density: Large logic element count enables complex, integrated digital systems on a single device, reducing board-level component count.
• Substantial on‑chip memory: Nearly 19.5 Mbits of embedded RAM supports buffering, queues, and state machines without relying on external memory.
• Robust industrial operation: −40 °C to 100 °C rating allows deployment in temperature-challenging environments common in industrial and infrastructure applications.
• Compact BGA package: 1152‑BBGA (35×35) offers a compact footprint with high I/O density for space-constrained designs.
• Predictable power planning: Defined core supply range of 0.82–0.88 V simplifies power-supply design and system integration.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA3H2F35I2LG?

The 5SGXEA3H2F35I2LG combines large logic capacity, significant embedded memory, and a high I/O count in a compact industrial-grade BGA package, making it well suited for complex embedded, networking, and industrial designs that demand integration and thermal robustness. Its defined voltage and temperature specifications enable predictable system design and deployment in demanding environments.

As a member of the Stratix V GX family from Intel, this device aligns with a platform-level ecosystem and documentation that supports development and scalability across projects that require substantial programmable logic resources and on-chip memory.

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