5SGXEA3H2F35I3L

The 5SGXEA3H2F35I3L is an Intel Stratix V GX field-programmable gate array (FPGA) offered in an industrial temperature grade. It provides a high-density programmable logic fabric with 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and rich I/O capability for complex system integration.

Designed for applications that require large on-chip logic capacity, substantial embedded RAM, and high-speed serial transceiver support, this device combines core FPGA resources with an FCBGA 1152-ball package and a low-voltage core supply range to support advanced, compact board designs.

Key Features

• High-density logic  Provides 340,000 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory.
• Extensive I/O  432 user I/O pins to enable dense peripheral and interface connectivity on modern boards.
• Transceiver capability  Stratix V GX family transceiver speed grades support multi-gigabit channel operation (series-level transceiver specifications are provided in the device datasheet).
• Power and voltage  Core supply voltage range 820 mV to 880 mV for compatibility with low-voltage FPGA power architectures.
• Industrial operating range  Rated for -40 °C to 100 °C operation to meet demanding environmental conditions.
• Package and mounting  1152-BBGA (1152-FBGA, 35×35) FCBGA package with surface-mount mounting type for compact, high-density PCB layouts.
• Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• High-speed serial communications  Implement multi-gigabit transceiver links and protocol processing using the Stratix V GX transceiver capabilities.
• Large-scale logic integration  Consolidate complex digital subsystems and custom IP into a single FPGA using 340,000 logic elements.
• Memory-intensive processing  On-chip embedded RAM (approximately 19.456 Mbits) for buffering, packet queues, and real-time data handling without relying solely on external memory.
• Industrial systems  Deploy in equipment operating across -40 °C to 100 °C where industrial temperature range and robust packaging are required.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable integration of substantial custom logic and multiple concurrent functions, reducing the need for multiple discrete devices.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory lowers dependence on external RAM and simplifies board-level memory design.
• High I/O density: 432 I/O pins facilitate extensive peripheral and interface connectivity in compact designs.
• Industrial-rated operation: Specified -40 °C to 100 °C for deployment in temperature-demanding environments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) supports high-density PCB layouts and surface-mount assembly processes.
• Low-voltage core: 820–880 mV supply range supports modern low-voltage power architectures for efficient board-level power design.

Why Choose 5SGXEA3H2F35I3L?

The 5SGXEA3H2F35I3L Stratix V GX FPGA delivers a combination of high logic capacity, substantial embedded memory, and multi-gigabit transceiver support in an industrial-grade package. Its 340,000 logic elements and approximately 19.456 Mbits of on-chip RAM make it suitable for consolidating complex digital subsystems while the 432 I/Os and compact 1152-FBGA package enable dense, production-ready board designs.

This part is well suited for teams building designs that require high integration density, robust thermal performance across -40 °C to 100 °C, and a low-voltage core supply. Use it where scalable logic, memory resources, and transceiver capabilities are key selection criteria.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEA3H2F35I3L Stratix V GX FPGA to begin your design evaluation and procurement process.