5SGXEA3H2F35I3N

The 5SGXEA3H2F35I3N is an Intel Stratix V GX field-programmable gate array (FPGA) IC designed for high-density programmable logic and embedded-memory applications. This industrial-grade device integrates approximately 340,000 logic elements and about 19.5 Mbits of on-chip RAM to support complex logic implementations and data buffering within a single surface-mount FCBGA package.

With 432 dedicated I/O and a compact 1152-BBGA (35 × 35 mm) footprint, the device targets designs that require a combination of large logic capacity, substantial embedded memory, and robust environmental range for industrial deployment.

Key Features

• Core Logic  Approximately 340,000 logic elements to implement large-scale, configurable digital logic functions.
• Embedded Memory  Approximately 19.5 Mbits of total on-chip RAM for data buffering, FIFOs, and scratchpad storage.
• I/O Capacity  432 I/O pins to support multiple parallel interfaces and high-density connectivity.
• Package & Mounting  1152-BBGA, FCBGA supplier package (1152-FBGA, 35 × 35 mm) designed for surface-mount assembly.
• Power Supply  Supported core voltage range from 820 mV to 880 mV for core power planning and delivery.
• Industrial Temperature Grade  Rated for an operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• RoHS Compliance  Device is RoHS compliant to meet environmental and manufacturing regulatory requirements.

Typical Applications

• High-density signal processing  Use the large logic element count and on-chip RAM for complex data-path implementations and algorithm acceleration.
• Protocol bridging and interface aggregation  Leverage 432 I/O for aggregating multiple interfaces, protocol conversion, and custom I/O pinouts.
• Industrial control and automation  Industrial temperature rating and robust package make the device suitable for factory and process-control systems.
• System integration and hardware acceleration  Combine abundant logic and memory resources to integrate custom peripherals, state machines, and acceleration blocks on a single FPGA.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable large, integrated digital designs without external ASICs.
• Substantial embedded memory: Approximately 19.5 Mbits of RAM reduces reliance on external memory for many buffering and storage needs.
• Generous I/O resources: 432 I/O pins simplify board-level integration of multiple parallel or mixed-signal interfaces.
• Industrial-grade durability: −40 °C to 100 °C operating range and industrial grade classification for deployment in demanding environments.
• Compact FCBGA packaging: 1152-BBGA (35 × 35 mm) package balances high pin count with a compact footprint for space-constrained designs.
• Environmentally compliant: RoHS compliance supports environmentally conscious manufacturing and regulatory needs.

Why Choose 5SGXEA3H2F35I3N?

The 5SGXEA3H2F35I3N Stratix V GX FPGA delivers a combination of large logic capacity, sizable embedded memory, and extensive I/O in a single industrial-grade FCBGA package. These characteristics make it well suited for engineers designing complex, integrated digital systems that demand on-chip resources and reliable operation across a wide temperature range.

Manufactured by Intel and specified for surface-mount assembly, this FPGA is appropriate for teams focused on scalable, high-density implementations that require a verified device-level specification for power, I/O, and thermal planning.

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