5SGXEA3H3F35C2G

The 5SGXEA3H3F35C2G is a Stratix® V GX field programmable gate array (FPGA) from Intel designed for high-density, commercial-temperature applications. It provides a large programmable fabric, substantial on-chip memory, and a high I/O count in a 1152‑ball FCBGA package for space-efficient, surface-mount integration.

Targeted use cases include complex digital signal processing, high-throughput data-path and protocol acceleration, and multi-interface system integration where dense logic, embedded memory, and numerous I/O are required.

Key Features

• Logic Capacity  Approximately 340,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, packet storage, and stateful logic.
• I/O Resources  432 user I/O pins to support multiple interfaces and parallel connectivity.
• Package & Mounting  1152‑BBGA (FCBGA, 35 × 35) supplier package designed for surface-mount PCB assembly and high pin-count routing.
• Core Voltage  Core voltage supply range of 870 mV to 930 mV for the device core domain.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS‑compliant manufacturing status.
• Stratix V GX Family Characteristics  Part of the Stratix V GX device family; the family datasheet documents commercial and industrial speed-grade and transceiver offerings for GX devices.

Typical Applications

• High‑performance networking  Large logic capacity and abundant on-chip RAM enable implementation of packet processing, switching, and custom network acceleration functions.
• Signal processing and communications  Stratix V GX family transceiver and fabric options make the device suitable for baseband processing, modulation/demodulation blocks, and protocol offload engines.
• Data‑path acceleration  High logic density and large embedded memory support custom data-plane engines, compression, and encryption accelerators.
• Multi‑interface system controllers  High I/O count supports bridging and aggregation of multiple peripheral interfaces and sensors in compact designs.

Unique Advantages

• High integration density: The combination of ~340,000 logic elements and ~19.46 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• Extensive I/O flexibility: 432 I/O pins provide the routing capacity needed for complex multi-interface applications without additional bridge devices.
• Compact high‑pin‑count package: The 1152‑BBGA (35 × 35) FCBGA package delivers a high pin density in a surface‑mount footprint suitable for space-constrained PCBs.
• Low‑voltage core operation: A core supply range of 870–930 mV supports low-power core operation strategies in system power budgeting.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation for standard commercial deployments.
• RoHS compliant: Manufactured to comply with RoHS directives for environmental and assembly considerations.

Why Choose 5SGXEA3H3F35C2G?

The 5SGXEA3H3F35C2G positions itself as a high-density Stratix V GX FPGA option for engineering teams needing substantial logic resources, embedded memory, and extensive I/O in a compact, surface-mount package. Its commercial-temperature rating and RoHS compliance make it suited to mainstream product applications and advanced prototypes that demand reliable on-chip resources.

Built on the Stratix V GX family platform from Intel, the device benefits from documented device characteristics and electrical specifications in the family datasheet, enabling confident integration into complex digital and data-path designs that require scalability and robust programmable resources.

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