5SGXEA3H3F35C2LN

The 5SGXEA3H3F35C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-performance digital designs. This commercial-grade device integrates a large logic fabric, substantial on-chip memory, and a broad I/O count to address demanding compute, networking, and signal-processing applications.

Built on the Stratix V GX family architecture, the device provides a balance of logic capacity, embedded RAM, and flexible packaging in a 1152-BBGA (35×35) FCBGA footprint, making it suitable for complex system integration where board space and integration matter.

Key Features

• Logic Capacity  340,000 logic elements enable complex custom logic and large-scale FPGA designs.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, caching, and local data storage.
• I/O Count  432 device I/O pins to support wide parallel interfaces and diverse peripheral connections.
• Package & Mounting  1152-BBGA, FCBGA package (1152-FBGA, 35×35) with surface-mount compatibility for compact board designs.
• Power Supply  Core voltage specified from 820 mV to 880 mV, enabling defined core-power planning and supply design.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for standard commercial environments.
• Standards Compliance  RoHS compliant to meet environmental restriction requirements.

Typical Applications

• Networking & Communications  High logic density and extensive I/O make this FPGA suitable for packet processing, switching fabrics, and custom protocol implementations.
• High-performance Compute  Large logic and embedded RAM support acceleration engines, data-path processing, and custom compute blocks.
• Signal Processing  On-chip memory and abundant logic resources enable real-time DSP pipelines, filtering, and multi-channel data handling.
• System Prototyping & Custom SoC  Use as a platform for prototyping complex SoC functions and integrating custom peripherals with high I/O counts.

Unique Advantages

• High logic density: 340,000 logic elements provide headroom for large, multi-function designs without immediate need for partitioning.
• Substantial embedded RAM: Approximately 19.5 Mbits of on-chip memory reduces external memory dependency for many buffering and caching tasks.
• Broad I/O flexibility: 432 I/O pins allow diverse interface support and parallel data streams directly from the device.
• Compact, industry-standard package: 1152-BBGA (35×35) FCBGA enables high-pin-count integration in constrained PCB real estate.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation fits typical commercial deployments and product lifecycles.
• Regulatory compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose 5SGXEA3H3F35C2LN?

The 5SGXEA3H3F35C2LN positions itself as a high-density Stratix V GX FPGA option for designers who need substantial logic fabric, significant embedded memory, and a large number of I/Os in a compact BGA package. Its specified core voltage range and commercial temperature grade provide defined parameters for system power and thermal design.

This device is ideal for engineering teams developing complex networking, compute acceleration, and signal-processing systems that require on-chip memory and high pin counts for integration. Backed by the Stratix V device family documentation and electrical characterization, it provides a verifiable foundation for performance-driven designs.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the 5SGXEA3H3F35C2LN Stratix V GX FPGA.